Datasheet
ABSOLUTE MAXIMUM RATINGS
(1)
PARAMETER INFORMATION
1
2
3
4
5
6
7
8 9
10
11
12
13
14
15
16
-INA
-INB
-INC
-V
S
+V
S
+V
S
-V
S
+INA
DISB
DISA
DISC
+INB
+INC
OUTC
OUTB
OUTA
OPA3695
SBOS355A – APRIL 2008 – REVISED SEPTEMBER 2008 ...............................................................................................................................................
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA,
PRODUCT PACKAGE DESIGNATOR RANGE MARKING NUMBER QUANTITY
OPA3695IDBQ Rails, 75
OPA3695 SSOP-16 DBQ – 40 ° C to +85 ° C OPA3695
OPA3695IDBQR Tape and Reel, 3000
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
Over operating free-air temperature range (unless otherwise noted).
OPA3695 UNIT
Power supply ± 6.5 V
DC
Internal power dissipation See Thermal Analysis
Differential input voltage ± 1.2 V
Input common-mode voltage range ± V
S
Storage temperature range: DBQ – 65 to +125 ° C
Lead temperature (soldering, 10s) +300 ° C
Junction temperature (T
J
) +125 ° C
Human body model (HBM) 1500 V
ESD rating Charge device model (CDM) 1000 V
Machine model (MM) 100 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these and any other conditions beyond
those specified is not supported.
SSOP-16
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