Datasheet

OPA3692
SBOS228E
2
www.ti.com
AC PERFORMANCE (see Figure 1)
Small-Signal Bandwidth (V
O
< 0.5V
PP
) G = +1 280 MHz typ C
G = [phone] MHz min B
G = –1 220 MHz typ C
Bandwidth for 0.1dB Gain Flatness G = +2, V
O
< 0.5V
PP
120 40 35 30 MHz min B
Peaking at a Gain of +1 V
O
< 0.5Vp-p 0.2 1 1.5 2 dB max B
Large-Signal Bandwidth G = +2, V
O
= 5V
PP
220 MHz typ C
Slew Rate G = +2, 4V Step 2000 1400 1375 1350 V/µsminB
Rise-and-Fall Time G = +2, V
O
= 0.5V Step 1.6 ns typ C
G = +2, V
O
= 5V Step 1.9 ns typ C
ABSOLUTE MAXIMUM RATINGS
(1)
Power Supply ............................................................................... ±6.5V
DC
Internal Power Dissipation
(2)
............................ See Thermal Information
Differential Input Voltage
(3)
............................................................... ±1.2V
Input Voltage Range............................................................................ ±V
S
Storage Temperature Range: D, DBQ...........................–65°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300°C
Junction Temperature (T
J
) ........................................................... +175°C
ESD Resistance: HBM .................................................................... 2000V
CDM .................................................................... 1500V
MM ........................................................................ 200V
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Packages must be derated based on specified
θ
JA
.
Maximum T
J
must be observed. (3) Noninverting input to internal inverting node.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PIN CONFIGURATION
Top View SSOP, SO
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
OPA3692 SO-16 D –40°C to +85°C OPA3692 OPA3692ID Rails, 48
"" """OPA3692IDR Tape and Reel, 2500
OPA3692 SSOP-16 DBQ –40°C to +85°C OPA3692 OPA3692IDBQT Tape and Reel, 250
"" """OPA3692IDBQR Tape and Reel, 2500
PACKAGE/ORDERING INFORMATION
(1)
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
–IN A
+IN A
DIS B
–IN B
+IN B
DIS C
–IN C
+IN C
DIS A
+V
S
OUT A
–V
S
OUT B
+V
S
OUT C
–V
S
OPA3692
402Ω
402Ω
402Ω
402Ω
402Ω
402Ω
ELECTRICAL CHARACTERISTICS: V
S
= ±5V
Boldface limits are tested at +25°C.
G = +2 (–IN grounded) and R
L
= 100Ω (see Figure 1 for AC performance only), unless otherwise noted.
OPA3692ID, OPA3692IDBQ
TYP MIN/MAX OVER TEMPERATURE
(1)
0°C to –40°C to MIN/ TEST
PARAMETER CONDITIONS +25°C +25°C70°C +85°C UNITS MAX LEVEL
(2 )