Datasheet

"#$
SB0S296C − MARCH 2004 − REVISED FEBRUARY 2005
www.ti.com
2
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT PACKAGE
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
OPA358
SC70-6
DCK
−40°C to +85°C
AUS
OPA358AIDCKT Tape and Reel, 250
OPA358
SC70-6
DCK
−40
°
C to +85
°
C
AUS
OPA358AIDCKR Tape and Reel, 3000
(1)
For the most current package and ordering information, see the Package Option Addendum located at the end of this document, or see the
TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage, V+ to V− +3.6V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signal Input Terminals, Voltage
(2)
(V−) −0.5V to (V+) + 0.5V. . . .
Signal Input Terminals, Current
(2)
±10mA. . . . . . . . . . . . . . . . . . . .
Output Short-Circuit
(3)
Continuous. . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature −40°C to +85°C. . . . . . . . . . . . . . . . . . . . . .
Storage Temperature −65°C to +150°C. . . . . . . . . . . . . . . . . . . . . . .
Junction Temperature +160°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (soldering, 10s) +300°C. . . . . . . . . . . . . . . . . . . .
ESD Rating:
Human Body Model (HBM) 4000V. . . . . . . . . . . . . . . . . . . . . . .
Charged Device Model (CDM) 1500V. . . . . . . . . . . . . . . . . . . .
Machine Model (MM) 400V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2)
Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current-limited to 10mA or less.
(3)
Short-circuit to ground, one amplifier per package.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PIN CONFIGURATIONS
(1) Pin 1 is determined by orienting the package marking as indicated in the diagram.
1
2
3
6
5
4
V+
Enable
Out
+
In
GND
−
In
OPA358
SC70−6
(1)
AUS