Datasheet

OPA333
OPA2333
SBOS351D –MARCH 2006–REVISED NOVEMBER 2013 www.ti.com
THERMAL INFORMATION: OPA333
OPA333
THERMAL METRIC
(1)
D (SOIC) DBV (SOT23) DCK (SC70) UNITS
8 PINS 5 PINS 5 PINS
θ
JA
Junction-to-ambient thermal resistance 140.1 220.8 298.4
θ
JCtop
Junction-to-case (top) thermal resistance 89.8 97.5 65.4
θ
JB
Junction-to-board thermal resistance 80.6 61.7 97.1
°C/W
ψ
JT
Junction-to-top characterization parameter 28.7 7.6 0.8
ψ
JB
Junction-to-board characterization parameter 80.1 61.1 95.5
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2333
OPA2333
THERMAL METRIC
(1)
D (SOIC) DGK (MSOP) DRB (DFN) UNITS
8 PINS 8 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 124.0 180.3 46.7
θ
JCtop
Junction-to-case (top) thermal resistance 73.7 48.1 26.3
θ
JB
Junction-to-board thermal resistance 64.4 100.9 22.2
°C/W
ψ
JT
Junction-to-top characterization parameter 18.0 2.4 1.6
ψ
JB
Junction-to-board characterization parameter 63.9 99.3 22.3
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A 10.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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