Datasheet

1
2
3
4
14
13
12
11
OUTD
-IND
+IND
V-
OUTA
-INA
+INA
V+
5
6
7
10
9
8
+INC
-INC
OUTC
+INB
-INB
OUTB
A
B
D
C
1
2
3
4
8
7
6
5
V+
OUTB
-INB
+INB
OUTA
-INA
+INA
V-
OUTA
-INA
+INA
V-
1
2
3
4
V+
OUTB
-INB
+INB
8
7
6
5
Exposed
Thermal
DiePad
on
Underside
(2)
1
2
3
5
4
V+
-IN
OUT
V-
+IN
1
2
3
5
4
V+
OUT
+IN
V-
-IN
OPA314
OPA2314
OPA4314
SBOS563F –MAY 2011–REVISED AUGUST 2013 www.ti.com
PIN CONFIGURATIONS
DCK PACKAGE
DBV PACKAGE
SC70-5
SOT23-5
(TOP VIEW)
(TOP VIEW)
DRB PACKAGE
(1)
D, DGK PACKAGES
DFN-8
SO-8, MSOP-8
(TOP VIEW)
(TOP VIEW)
PW PACKAGE
TSSOP-14
(TOP VIEW)
(1) Pitch: 0,65 mm.
(2) Connect thermal pad to V–. Pad size: 1,8 mm × 1,5 mm.
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Product Folder Links: OPA314 OPA2314 OPA4314