Datasheet

OPA314
OPA2314
OPA4314
www.ti.com SBOS563F –MAY 2011–REVISED AUGUST 2013
THERMAL INFORMATION: OPA314
OPA314
THERMAL METRIC
(1)
DBV (SOT23) DCK (SC70) UNITS
5 PINS 5 PINS
θ
JA
Junction-to-ambient thermal resistance 228.5 281.4
θ
JC(top)
Junction-to-case(top) thermal resistance 99.1 91.6
θ
JB
Junction-to-board thermal resistance 54.6 59.6
°C/W
ψ
JT
Junction-to-top characterization parameter 7.7 1.5
ψ
JB
Junction-to-board characterization parameter 53.8 58.8
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2314
OPA2314
THERMAL METRIC
(1)
D (SO) DGK (MSOP) DRB (DFN) UNITS
8 PINS 8 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 138.4 191.2 53.8
θ
JC(top)
Junction-to-case(top) thermal resistance 89.5 61.9 69.2
θ
JB
Junction-to-board thermal resistance 78.6 111.9 20.1
°C/W
ψ
JT
Junction-to-top characterization parameter 29.9 5.1 3.8
ψ
JB
Junction-to-board characterization parameter 78.1 110.2 20.0
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A 11.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4314
OPA4314
THERMAL METRIC
(1)
PW (TSSOP) UNITS
14 PINS
θ
JA
Junction-to-ambient thermal resistance 121.0
θ
JC(top)
Junction-to-case(top) thermal resistance 49.4
θ
JB
Junction-to-board thermal resistance 62.8
°C/W
ψ
JT
Junction-to-top characterization parameter 5.9
ψ
JB
Junction-to-board characterization parameter 62.2
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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