Datasheet

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SBOS271D − MAY 2003 − REVISED JUNE 2007
www.ti.com
2
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
OPA300
SO-8
D
300A
OPA300
SO-8
D
300A
OPA300
SOT23-6
DBV
A52
OPA300
SOT23-6
DBV
A52
OPA301
SO-8
D
301A
OPA301
SO-8
D
301A
OPA301
SOT23-5
DBV
AUP
OPA301
SOT23-5
DBV
AUP
OPA2300 MSOP−10 DGS C01
OPA2301 SO−8 D OPA2301A
OPA2301 MSOP−8 DGK OAWM
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
Power Supply V+ 7V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signal Input Terminals
(2)
, Voltage 0.5V to (V+) + 0.5V. . . . . . . . . . .
Current ±10mA. . . . . . . . . . . . . . . . . . . . .
Open Short-Circuit Current
(3)
Continuous. . . . . . . . . . . . . . . . . . . .
Operating Temperature Range −55°C to +125°C. . . . . . . . . . . . . . .
Storage Temperature Range −60°C to +150°C. . . . . . . . . . . . . . . . .
Junction Temperature +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Ratings
Human Body Model (HBM) 4kV. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charged-Device Model (CDM) 500V. . . . . . . . . . . . . . . . . . . . . . . .
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2)
Input terminals are diode clamped to the power-supply rails. Input
signals that can swing more than 0.5V beyond the supply rails
should be current limited to 10mA or less.
(3)
Short-circuit to ground; one amplifier per package.
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PIN ASSIGNMENTS
Top View MSOP, SO, SOT
NOTE: (1) Not connected. (2) SOT23-6 pin 1 oriented as shown with reference to package marking.
1
2
3
4
8
7
6
5
Enable
V+
V
OUT
NC
(1)
NC
(1)
−
In
+In
V
−
OPA300
SO−8
1
2
3
4
8
7
6
5
NC
(1)
V+
V
OUT
NC
(1)
NC
(1)
−
In
+In
V
−
OPA301
SO−8
1
2
3
5
4
V+
−
In
Out
V
−
+In
OPA301
SOT23−5
1
2
3
6
5
4
V+
Enable
−
In
Out
V
−
+In
OPA300
SOT23−6
(2)
A52
1
2
3
4
8
7
6
5
V+
Out B
−In B
+In B
Out A
−In A
+In A
V
−
A
B
OPA2301
SO−8, MSOP−8
1
2
3
4
5
10
9
8
7
6
V+
Out B
−
In B
+In B
Enable B
Out A
−
In A
+In A
V
−
Enable A
A
B
OPA2300
MSOP−10