Datasheet

ABSOLUTE MAXIMUM RATINGS
(1)
PIN ASSIGNMENTS
1
2
3
4
8
7
6
5
+V
S
OutB
-InB
+InB
OutA
-InA
+InA
-V
S
A
B
TopView
SO-8
TopView
MSOP-10
1
2
3
4
5
10
9
8
7
6
-InA
OutA
+V
S
OutB
-InB
+InA
DISA
-V
S
DISB
+InB
OPA2889
SBOS373B – JUNE 2007 – REVISED AUGUST 2008 ....................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
OPA2889ID Rail, 75
OPA2889 SO-8 D – 40 ° C to +85 ° C OP2889
OPA2889IDR Tape and Reel, 2500
OPA2889IDGST Tape and Reel, 250
OPA2889 MSOP-10 DGS – 40 ° C to +85 ° C BZY
OPA2889IDGSR Tape and Reel, 2500
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
Over operating free-air temperature range, unless otherwise noted.
OPA2889 UNIT
Power supply ± 6.5 V
Internal power dissipation See Thermal Characteristics
Input voltage range ± V
S
V
Storage temperature range – 65 to +125 ° C
Lead temperature (soldering, 10s) +260 ° C
Maximum junction temperature (T
J
) +150 ° C
Maximum junction temperature (T
J
), continuous operation +140 ° C
ESD Rating:
Human body model (HBM) 2000 V
Charge device model (CDM) 1000 V
Machine model (MM) 150 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
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Product Folder Link(s): OPA2889