Datasheet
OPA2822
2
SBOS188E
www.ti.com
Supply Voltage ................................................................................. ±6.5V
Internal Power Dissipation........................... See Thermal Characteristics
Differential Input Voltage .................................................................. ±1.2V
Input Voltage Range............................................................................ ±V
S
Storage Temperature Range .........................................–65°C to +125°C
Lead Temperature (SO-8) ............................................................. +260°C
Junction Temperature (T
J
) ........................................................... +150°C
ESD Rating (Human Body Model) .................................................. 2000V
(Machine Model) ........................................................... 200V
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE/ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
OPA2822U SO-8 Surface-Mount D –40°C to +85°C OPA2822U OPA2822U Rails, 100
"" " ""OPA2822U/2K5 Tape and Reel, 2500
OPA2822E MSOP-8 Surface-Mount DGK –40°C to +85°C D22 OPA2822E/250 Tape and Reel, 250
"" " ""OPA2822E/2K5 Tape and Reel, 2500
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from per-
formance degradation to complete device failure. Texas In-
struments recommends that all integrated circuits be handled
and stored using appropriate ESD protection methods.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet published speci-
fications.
Top View SO
PIN CONFIGURATION/MSOP PACKING MARKING
MSOP PACKAGE MARKING
1
2
3
4
8
7
6
5
+V
S
Out B
–In B
+In B
Out A
–In A
+In A
–V
S
OPA2822
D22
8765
1234