Datasheet
OPA27, OPA37
2
SBOS135C
www.ti.com
Top View
PIN CONFIGURATION
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage................................................................................... ±22V
Internal Power Dissipation
(2)
....................................................... 500mW
Input Voltage ..................................................................................... ±V
CC
Output Short-Circuit Duration
(3)
................................................. Indefinite
Differential Input Voltage
(4)
............................................................. ±0.7V
Differential Input Current
(4)
........................................................... ±25mA
Storage Temperature Range .......................................... –55°C to +125°C
Operating Temperature Range......................................... –40°C to +85°C
Lead Temperature:
P (soldering, 10s) ....................................................................... +300°C
U (soldering, 3s) ......................................................................... +260°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. (2) Maximum package power dissipation versus ambient
temperature. (2) To common with ±V
CC
= 15V. (4) The inputs are protected by
back-to-back diodes. Current limiting resistors are not used in order to achieve
low noise. If differential input voltage exceeds ±0.7V, the input current should
be limited to 25mA.
PACKAGE PACKAGE
PRODUCT PACKAGE-LEAD
θ
JA
DRAWING MARKING
OPA27 DIP-8 100°C/W P OPA27GP
OPA27 SO-8 160°C/W D OPA27U
OPA37 DIP-8 100°C/W P OPA37GP
OPA37 SO-8 160°C/W D OPA37U
NOTE: (1) For the most current package and ordering information, see the
Package Option Addendum located at the end of this document, or see the TI
website at www.ti.com.
PACKAGE/ORDERING INFORMATION
(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
1
2
3
4
5
6
7
8
Offset Trim
+V
CC
–In
+In
–V
CC
Output
NC
NC = No Connection
Offset Trim