Datasheet

ABSOLUTE MAXIMUM RATINGS
(1)
PIN CONFIGURATIONS
1
2
3
4
8
7
6
5
OutA
-V
S
+V
S
OutB
-InA
+InA
+InB
-InB
1
2
3
4
12
11
10
9
NC
NC
NC
NC
16
15
14
13
5 6 7 8
-INA
-INB
+INA
DISB
+INB
-V
S
+V
S
+V
S
-V
S
DISA
OUTA
OUTB
OPA2695
SBOS354A – APRIL 2008 – REVISED AUGUST 2008 ...................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA,
PRODUCT PACKAGE DESIGNATOR RANGE MARKING NUMBER QUANTITY
OPA2695ID Rails, 75
OPA2695 SO-8 D – 40 ° C to +85 ° C OP2695
OPA2695IDR Tape and Reel, 2500
OPA2695IRGTT Tape and Reel, 250
OPA2695 QFN-16 RGT – 40 ° C to +85 ° C 2695
OPA2695IRGTR Tape and Reel, 3000
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
OPA2695 UNITS
Power supply ± 6.5 V
DC
Internal power dissipation See Thermal Analysis
Differential input voltage ± 1.2 V
Input common-mode voltage range ± V
S
V
Storage temperature range: D, RGT – 65 to +125 ° C
Lead temperature (soldering, 10s) +300 ° C
Junction temperature (T
J
) +150 ° C
Junction temperature (T
J
), continuous operation +140 ° C
Human body model (HBM)
(2)
1500 V
ESD rating: Charged device model (CDM) 1000 V
Machine model (MM) 50 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these and any other conditions beyond
those specified is not supported.
(2) Pins 1 and 4 on the SO-8 package and pins 6 and 15 on the QFN package are greater than 500V HBM.
SO-8 PACKAGE
QFN-16 PACKAGE
(TOP VIEW)
(TOP VIEW)
2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): OPA2695