Datasheet

OPA2691
2
SBOS224D
www.ti.com
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
OPA2691 SO-8 D –40°C to +85°C OPA2691 OPA2691ID Rails, 100
" """"OPA2691IDR Tape and Reel, 2500
OPA2691 SO-14 D –40°C to +85°C OPA2691 OPA2691I-14D Rails, 58
" """"OPA2691I-14DR Tape and Reel, 2500
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at
www.ti.com.
1
2
3
4
5
6
7
NC = No Connection
14
13
12
11
10
9
8
–In A
+In A
DIS A
–V
S
DIS B
+In B
–In B
Out A
NC
NC
+V
S
NC
NC
Out B
ABSOLUTE MAXIMUM RATINGS
(1)
Power Supply ............................................................................... ±6.5V
DC
Internal Power Dissipation
(2)
............................ See Thermal Information
Differential Input Voltage .................................................................. ±1.2V
Input Voltage Range ........................................................................... ±V
S
Storage Temperature Range: D, 14D ............................ –65°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300°C
Junction Temperature (T
J
) ........................................................... +175°C
ESD Performance:
HBM .............................................................................................. 2000V
CDM .............................................................................................. 1500V
NOTES:: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability. (2) Packages
must be derated based on specified
θ
JA
. Maximum T
J
must be observed.
PIN CONFIGURATIONS
Top View SO-8
SO-14
1
2
3
4
8
7
6
5
+V
S
Out B
–In B
+In B
Out A
–In A
+In A
–V
S
PACKAGE/ORDERING INFORMATION
(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.