Datasheet
OPA2677
2
SBOS126I
www.ti.com
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
OPA2677 SO-8 D –40°C to +85°C OPA2677U OPA2677U Rails, 100
" " " " " OPA2677U/2K5 Tape and Reel, 2500
OPA2677 HSOP-8 DDA –40°C to +85°C OP2677 OPA2677IDDA Rails, 75
" " " " " OPA2677IDDAR Tape and Reel, 2500
OPA2677 QFN-16 RGV –40°C to +85°C OPA2677 OPA2677IRGVT Tape and Reel, 250
OPA2677IRGVR Tape and Reel, 2500
ABSOLUTE MAXIMUM RATINGS
(1)
Power Supply ............................................................................... ±6.5V
DC
Internal Power Dissipation .......................... See Thermal Characteristics
Differential Input Voltage .................................................................. ±1.2V
Input Common-Mode Voltage Range ................................................. ±V
S
Storage Temperature Range: U, DDA, RGV .................–65°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300°C
Junction Temperature (T
J
) ........................................................... +150°C
ESD Rating:
Human Body Model (HBM)
(2)
....................................................... 2000V
Charge Device Model (CDM) ....................................................... 1000V
Machine Model (MM) ..................................................................... 100V
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability.
(2) Pins 2 and 6 on SO-8 and HSOP-8 packages, and pins 2 and
11 on QFN-16 package > 500V HBM.
PIN CONFIGURATIONS
Top View
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
(1)
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at
www.ti.com.
1
2
3
4
12
11
10
9
NC
–In B
+In B
NC
16 15 14 13
Out A
NC
+V
S
Out B
5 678
NC
NC
–V
S
NC
OPA2677RGV
QFN-16
NC
–In A
+In A
NC
1
2
3
4
8
7
6
5
+V
S
Out B
–In B
+In B
OPA2677U, DDA
SO-8, HSOP-8
Out A
–In A
+In A
–V
S
NOTE: Exposed thermal pad on HSOP-8 and QFN-16 must be tied to –V
S
.