Datasheet

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SBOS270C − AUGUST 2003 − REVISED AUGUST 2008
www.ti.com
2
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT PACKAGE−LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
OPA2674 SO-8 D −40°C to +85°C OPA2674ID OPA2674ID Rails, 100
″ ″ ″ ″ ″ OPA2674IDR Tape and Reel, 2500
OPA2674 SO-14 D −40°C to +85°C OPA2674I-14D OPA2674I-14D Rails, 58
″ ″ ″ ″ ″ OPA2674I-14DR Tape and Reel, 2500
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Power Supply ±6.5V
DC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Power Dissipation See Thermal Analysis. . . . . . . . . . . . . .
Differential Input Voltage ±1.2V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Common-Mode Voltage Range ±V
S
. . . . . . . . . . . . . . . . . . . .
Storage Temperature Range: D, -14D −65°C to +125°C. . . . . . . . . . .
Lead Temperature (soldering, 10s) +300°C. . . . . . . . . . . . . . . . . . . . .
Junction Temperature (T
J
) +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Rating
Human Body Model (HBM)
(2)
2000V. . . . . . . . . . . . . . . . . . . . . .
Charge Device Model (CDM) 1000V. . . . . . . . . . . . . . . . . . . . . .
Machine Model (MM) 100V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2)
Pins 2 and 6 on SO-8 package, and pins 1 and 7 on SO-14
package > 500V HBM.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PIN CONFIGURATIONS
NC = No Connection
1
2
3
4
8
7
6
5
+V
S
Out B
−
In B
+In B
OPA2674ID
Out A
−
In A
+In A
−
V
S
1
2
3
4
5
6
7
14
13
12
11
10
9
8
−
In A
+In A
A0
−
V
S
A1
+In B
−
In B
Out A
NC
NC
+V
S
NC
NC
Out B
Power
Control
OPA2674I−14D
TOP VIEW SO−8 TOP VIEW SO−14