Datasheet

NC
(1)
-INA
+INA
GND
NC
(1)
-INB
+INB
A1
OUTA NC
(1)
+V
S
OUTB
1
2
3
4
12
11
10
9
16 15 14 13
NC
(1)
NC
(1)
-V
S
A0
5 6 7 8
OPA2673
SBOS382F –JUNE 2008–REVISED MAY 2010 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE- PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT MEDIA,
PRODUCT LEAD DESIGNATOR RANGE MARKING NUMBER QUANTITY
OPA2673IRGVT Tape and Reel, 250
OPA2673 QFN-16 RGV –40°C to +85°C OPA2673
OPA2673IRGVR Tape and Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER OPA2673 UNIT
Power supply ±6.5 V
DC
Internal power dissipation See Thermal Characteristics
Differential input voltage ±2 V
Input common-mode voltage range ±V
S
V
Storage temperature range: RGV package –65 to +125 °C
Junction temperature, T
J
+150 °C
Continuous operating junction temperature +139 °C
Human body model (HBM) 2000 V
ESD
Charge device model (CDM) 1500 V
rating:
Machine model (MM) 200 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
PIN CONFIGURATION
RGV PACKAGE
QFN-16
(TOP VIEW)
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