Datasheet

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SBOS235E − MARCH 2002− REVISED MAY 2009

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5. Connect all holes, including those within the thermal pad

area and outside the pad area, to the internal ground plane

or other internal copper plane for single-supply

applications, and to V− for split-supply applications.

6. When laying out these holes, do not use the typical web

or spoke via connection methodology, as shown in

Figure 12. Web connections have a high thermal

resistance connection that is useful for slowing the heat

transfer during soldering operations. This makes soldering

the vias that have ground plane connections easier.

However, in this application, low thermal resistance is

desired for the most efficient heat transfer. Therefore, the

holes under the PowerPAD package should make their

connection to the internal ground plane with a complete

connection around the entire circumference of the

plated-through hole.

Web or Spoke Via

Solid Via

NOT RECOMMENDED

(due to poor heat conduction)

RECOMMENDED

Figure 12. Via Connection

7. The top-side solder mask should leave the pad

connections and the thermal pad area exposed. The

thermal pad area should leave the 13 mil holes exposed.

The larger holes outside the thermal pad area may be

covered with solder mask.

8. Apply solder paste to the exposed thermal pad area and

all of the package terminals.

9. With these preparatory steps in place, the PowerPAD IC

is simply placed in position and run through the solder

reflow operation as any standard surface-mount

component. This results in a part that is properly installed.

For detailed information on the PowerPAD package

including thermal modeling considerations and repair

procedures, please see Technical Brief SLMA002,

PowerPAD Thermally Enhanced Package, located at