Datasheet
OPA2348-Q1
OPA4348-Q1
SBOS465A –JANUARY 2009–REVISED MARCH 2010
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
V
S
Supply voltage, V– to V+ 7.5 V
V
IN
Input voltage, signal input terminals
(2)
(V– – 0.5 V) to (V+ + 0.5 V)
I
IN
Input current, signal input terminals
(2)
10 mA
Output short-circuit duration
(3)
Continuous
D package 97.1°C/W
q
JA
Thermal impedance, junction to free air
(4)
PW package 100°C/W
T
A
Operating free-air temperature –40°C to +150°C
T
STG
Storage temperature –65°C to +150°C
T
J
Operating virtual-junction temperature 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current-limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
(4) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
V
S
Supply voltage, V– to V+ 2.1 5.5 V
T
A
Operating free-air temperature –40 125 °C
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