Datasheet

OPA347, 2347, 4347
2
SBOS167D
www.ti.com
PACKAGE PACKAGE
PRODUCT PACKAGE/LEAD DESIGNATOR MARKING
OPA347NA SOT23-5 DBV A47
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OPA347PA DIP-8 P OPA347PA
OPA347UA SO-8 D OPA347UA
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OPA347SA SC-70 DCK S47
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OPA2347EA SOT23-8 DCN B47
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OPA2347UA SO-8 D OPA2347UA
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OPA2347YED WCSP-8 YED YMD CCS
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OPA2347YZDR Lead-Free WCSP-8 YZD A9
OPA4347EA TSSOP-14 PW OPA4347EA
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OPA4347UA SO-14 D OPA4347UA
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NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com.
PACKAGE/ORDERING INFORMATION
(1)
Supply Voltage, V+ to V– ................................................................... 7.5V
Signal Input Terminals, Voltage
(2)
.................. (V–) – 0.5V to (V+) + 0.5V
Current
(2)
.................................................... 10mA
Output Short-Circuit
(3)
.............................................................. Continuous
Operating Temperature ..................................................–65°C to +150°C
Storage Temperature ..................................................... –65°C to +150°C
Junction Temperature ...................................................................... 150°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only. Functional opera-
tion of the device at these conditions, or beyond the specified operating
conditions, is not implied. (2) Input terminals are diode-clamped to the
power-supply rails. Input signals that can swing more than 0.5V beyond the
supply rails should be current-limited to 10mA or less. (3) Short-circuit to
ground, one amplifier per package.
ABSOLUTE MAXIMUM RATINGS
(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper
handling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.