Datasheet

OPA347, 2347, 4347
11
SBOS167D
www.ti.com
OPA2347 WCSP PACKAGE
The OPA2347YED and OPA2347YZDR are die-level pack-
ages using bump-on-pad technology. The OPA2347YED de-
vice has tin-lead balls; the OPA2347YZDR has lead-free
balls. Unlike devices that are in plastic packages, these
devices have no molding compound, lead frame, wire bonds,
or leads. Using standard surface-mount assembly procedures,
the WCSP can be mounted to a printed circuit board without
additional under fill. Figures 10 and 11 detail pinout and
package marking.
FIGURE 10. Pin Description.
FIGURE 11. Top View Package Marking.
1
2
3
4
1
8
7
6
5
V+
Out B
–In B
+In B
Out A
–In A
+In A
V–
OPA2347
(bump side down)
Not to Scale
WCSP-8
(top view)
TEST CONDITION ACCEPT CRITERIA (ACTUAL) SAMPLE SIZE
Temperature Cycle –40°C to 125°C, 1 Cycle/hr, 15 Minute Ramp
(1)
10 Minute Dwell 500 (1600) Cycles, R < 1.2X from R
0
36
Drop 50cm 10 (129) Drops, R < 1.2X from R
0
8
Key Push 100 Cycles/min, 5K (6.23K) Cycles, R < 1.2X from R
0
8
1300 µε, Displacement = 2.7mm Max
3 Point Bend Strain Rate 5 mm/min, 85 mm Span R < 1.2X from R
0
8
NOTE: (1) Per IPC9701.
TABLE I. Reliability Test Results.
1
OPA2347YED
Top View
YMDCCS
(bump side down)
Actual Size:
Package Marking Code:
YMD = year/month/day
CC = indicates OPA2347YED
A9 = indicates OPA2347YZD
S = for engineering purposes only
Exact Size:
1.008mm x 2.100mm
PHOTOSENSITIVITY
Although the OPA2347YED/YZD package has a protective
backside coating that reduces the amount of light exposure
on the die, unless fully shielded, ambient light will still reach
the active region of the device. Input bias current for the
OPA2347YED/YZD package is specified in the absence of
light. Depending on the amount of light exposure in a given
application, an increase in bias current, and possible in-
creases in offset voltage should be expected. In circuit board
tests under ambient light conditions, a typical increase in bias
current reached 100pA. Flourescent lighting may introduce
noise or hum due to their time varying light output. Best
practice should include end-product packaging that provides
shielding from possible light souces during operation.
RELIABILITY TESTING
To ensure reliability, the OPA2347YED and OPA2347YZDR
devices have been verified to successfully pass a series of
reliability stress tests. A summary of JEDEC standard reli-
ability tests is shown in Table I.