Datasheet

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DFN PACKAGE DFN LAYOUT GUIDELINES
OPA333
OPA2333
SBOS351C – MARCH 2006 – REVISED MAY 2007
The OPA2333 is offered in an DFN-8 package (also The exposed leadframe die pad on the DFN package
known as SON). The DFN is a QFN package with should be soldered to a thermal pad on the PCB. A
lead contacts on only two sides of the bottom of the mechanical drawing showing an example layout is
package. This leadless package maximizes board attached at the end of this data sheet. Refinements
space and enhances thermal and electrical to this layout may be necessary based on assembly
characteristics through an exposed pad. process requirements. Mechanical drawings located
at the end of this data sheet list the physical
DFN packages are physically small, have a smaller
dimensions for the package and pad. The five holes
routing area, improved thermal performance, and
in the landing pattern are optional, and are intended
improved electrical parasitics. Additionally, the
for use with thermal vias that connect the leadframe
absence of external leads eliminates bent-lead
die pad to the heatsink area on the PCB.
issues.
Soldering the exposed pad significantly improves
The DFN package can be easily mounted using
board-level reliability during temperature cycling, key
standard printed circuit board (PCB) assembly
push, package shear, and similar board-level tests.
techniques. See Application Note QFN/SON PCB
Even with applications that have low-power
Attachment (SLUA271 ) and Application Report Quad
dissipation, the exposed pad must be soldered to the
Flatpack No-Lead Logic Packages (SCBA017 ), both
PCB to provide structural integrity and long-term
available for download at www.ti.com .
reliability.
The exposed leadframe die pad on the bottom of
the package should be connected to V– or left
unconnected.
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