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FEATURES DESCRIPTION

APPLICATIONS

0.1HzTO10HzNOISE

500nV/div

1s/div

V+

-IN

OUT

V-

+IN

OPA333

SOT23-5

V+

OUT

+IN

V-

-IN

OPA333

SC70-5

OPA333

OPA2333

SBOS351C – MARCH 2006 – REVISED MAY 2007

1.8V, microPOWER

CMOS OPERATIONAL AMPLIFIERS

Zerø-Drift Series

• LOW OFFSET VOLTAGE: 10 μ V (max)

The OPA333 series of CMOS operational amplifiers

uses a proprietary auto-calibration technique to

• ZERO DRIFT: 0.05 μ V/ ° C (max)

simultaneously provide very low offset voltage (10 μ V

• 0.01Hz to 10Hz NOISE: 1.1 μ V

max) and near-zero drift over time and temperature.

• QUIESCENT CURRENT: 17 μ A

These miniature, high-precision, low quiescent

• SINGLE-SUPPLY OPERATION current amplifiers offer high-impedance inputs that

have a common-mode range 100mV beyond the rails

• SUPPLY VOLTAGE: 1.8V to 5.5V

and rail-to-rail output that swings within 50mV of the

• RAIL-TO-RAIL INPUT/OUTPUT

rails. Single or dual supplies as low as +1.8V ( ± 0.9V)

• microSIZE PACKAGES: SC70 and SOT23

and up to +5.5V ( ± 2.75V) may be used. They are

optimized for low-voltage, single-supply operation.

The OPA333 family offers excellent CMRR without

• TRANSDUCER APPLICATIONS

the crossover associated with traditional

• TEMPERATURE MEASUREMENTS complementary input stages. This design results in

superior performance for driving analog-to-digital

• ELECTRONIC SCALES

converters (ADCs) without degradation of differential

• MEDICAL INSTRUMENTATION

linearity.

• BATTERY-POWERED INSTRUMENTS

The OPA333 (single version) is available in the

• HANDHELD TEST EQUIPMENT

SC70-5, SOT23-5, and SO-8 packages. The

OPA2333 (dual version) is offered in DFN-8 (3mm ×

3mm), MSOP-8, and SO-8 packages. All versions

are specified for operation from –40 ° C to +125 ° C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (28 pages)

PAGE 1
OPA333 OPA2333 SBOS351C – MARCH 2006 – REVISED MAY 2007 1.8V, microPOWER CMOS OPERATIONAL AMPLIFIERS Zerø-Drift Series FEATURES • • • • • • • • DESCRIPTION LOW OFFSET VOLTAGE: 10μV (max) ZERO DRIFT: 0.05μV/°C (max) 0.01Hz to 10Hz NOISE: 1.1μVPP QUIESCENT CURRENT: 17μA SINGLE-SUPPLY OPERATION SUPPLY VOLTAGE: 1.8V to 5.
PAGE 2
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS/2, VCM = VS/2, and VOUT = VS/2, unless otherwise noted. OPA333, OPA2333 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 2 10 μV 0.02 0.05 μV/°C 1 5 μV/V OFFSET VOLTAGE Input Offset Voltage VOS vs Temperature dVOS/dT vs Power Supply PSRR VS = +5V VS = +1.
PAGE 4
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 PIN CONFIGURATIONS OPA333 OUT 1 V- 2 +IN 3 OPA333 OPA333 SOT23-5 SO-8 SC70-5 Top View Top View Top View 5 4 V+ -IN (1) (1) 1 8 NC -IN 2 7 V+ +IN 3 6 OUT NC 4 V- 5 NC DFN-8 Top View Top View 8 V+ 7 OUT B 6 -IN B 5 +IN B A -IN A 2 +IN A 3 V- 4 B OUT A 1 -IN A 2 +IN A 3 V- 4 1. NC denotes no internal connection. 2. Connect thermal die pad to V–.
PAGE 5
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 TYPICAL CHARACTERISTICS At TA = +25°C, VS = +5V, and CL = 0pF, unless otherwise noted. OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 0 0.0025 0.0050 0.0075 0.0100 0.0125 0.0150 0.0175 0.0200 0.0225 0.0250 0.0275 0.0300 0.0325 0.0350 0.0375 0.0400 0.0425 0.0450 0.0475 0.
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OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = +5V, and CL = 0pF, unless otherwise noted. INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE INPUT BIAS CURRENT vs TEMPERATURE 100 200 80 VS = 5.5V VS = 1.8V 150 -IB 60 -IB 100 40 IB (pA) IB (pA) -IB 50 20 0 0 -20 +IB -50 -40 -100 -60 +IB +IB -150 -80 -200 -100 1 0 2 3 4 5 0 -25 -50 Common-Mode Voltage (V) 50 75 Figure 7. Figure 8.
PAGE 7
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = +5V, and CL = 0pF, unless otherwise noted. NEGATIVE OVER-VOLTAGE RECOVERY SETTLING TIME vs CLOSED-LOOP GAIN 600 4V Step 500 Settling Time (ms) 1V/div 2V/div Input 0 0 10kW +2.5V 1kW 400 300 200 0.001% Output OPA333 100 0.01% -2.5V 0 Time (50ms/div) 10 1 100 Gain (dB) Figure 13. Figure 14. SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 0.
PAGE 8
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 APPLICATIONS INFORMATION The OPA333 and OPA2333 are unity-gain stable and free from unexpected output phase reversal. They use a proprietary auto-calibration technique to provide low offset voltage and very low drift over time and temperature. For lowest offset voltage and precision performance, circuit layout and mechanical conditions should be optimized.
PAGE 9
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 ACHIEVING OUTPUT SWING TO THE OP AMP NEGATIVE RAIL works with some types of output stages. The OPA333 and OPA2333 have been characterized to perform with this technique; the recommended resistor value is approximately 20kΩ. Note that this configuration will increase the current consumption by several hundreds of microamps. Accuracy is excellent down to 0V and as low as –2mV.
PAGE 10
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 Figure 21 shows the basic configuration for a bridge amplifier. VEX A low-side current shunt monitor is shown in Figure 22. RN are operational resistors used to isolate the ADS1100 from the noise of the digital I2C bus. Since the ADS1100 is a 16-bit converter, a precise reference is essential for maximum accuracy. If absolute accuracy is not required, and the 5V power supply is sufficiently stable, the REF3130 may be omitted.
PAGE 11
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 V1 -In INA152 OPA333 2 1MW 3V NTC Thermistor 1MW 5 R2 100kW 60kW 6 R1 VO R2 OPA333 1 3 OPA333 V2 +In VO = (1 + 2R2/R1) (V2 - V1) Figure 24. Thermistor Measurement Figure 25. Precision Instrumentation Amplifier +VS R1 100kW fLPF = 150Hz C4 1.
PAGE 12
OPA333 OPA2333 www.ti.com SBOS351C – MARCH 2006 – REVISED MAY 2007 DFN PACKAGE DFN LAYOUT GUIDELINES The OPA2333 is offered in an DFN-8 package (also known as SON). The DFN is a QFN package with lead contacts on only two sides of the bottom of the package. This leadless package maximizes board space and enhances thermal and electrical characteristics through an exposed pad. The exposed leadframe die pad on the DFN package should be soldered to a thermal pad on the PCB.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.
PAGE 15
PACKAGE OPTION ADDENDUM www.ti.com 4-Sep-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing OPA2333AIDGKT VSSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGK 8 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2333AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2333AIDRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 4-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2333AIDGKT VSSOP DGK OPA2333AIDR SOIC D 8 250 364.0 364.0 27.0 8 2500 367.0 367.0 35.0 OPA2333AIDRBR SON OPA2333AIDRBT SON DRB 8 3000 367.0 367.0 35.0 DRB 8 250 210.0 185.0 OPA333AIDBVR 35.0 SOT-23 DBV 5 3000 203.0 203.0 35.0 OPA333AIDBVR SOT-23 DBV 5 3000 180.0 180.0 18.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.