Datasheet

PIN CONFIGURATIONS
1
2
3
4
8
7
6
5
NC
(1)
V+
OUT
NC
(1)
NC
(1)
-IN
+IN
V-
1
2
3
4
8
7
6
5
Shutdown
(3)
V+
OUT
NC
(1)
NC
(1)
-IN
+IN
V-
1
2
3
4
8
7
6
5
Shutdown
(3)
V+
OUT
NC
(1)
NC
(1)
-IN
+IN
V-
Pad
(2)
1
2
3
4
8
7
6
5
V+
OUTB
-INB
+INB
OUTA
-INA
+INA
V-
Pad
(2)
A
B
1
2
3
4
8
7
6
5
V+
OUTB
-INB
+INB
OUTA
-INA
+INA
V-
A
B
Pad
(2)
OPA211
OPA2211
www.ti.com
...................................................................................................................................................... SBOS377G OCTOBER 2006 REVISED MAY 2009
OPA211
OPA211
SO-8
MSOP-8
OPA211
OPA2211
DFN-8 (3mm × 3mm)
DFN-8 (3mm × 3mm)
OPA2211
SO-8 PowerPAD
(1) NC denotes no internal connection.
(2) Exposed thermal die pad on underside; connect thermal die pad to V . Soldering the thermal pad improves heat
dissipation and provides specified performance.
(3) Shutdown function:
Device enabled: (V ) V
SHUTDOWN
(V+) 3V
Device disabled: V
SHUTDOWN
(V+) 0.35V
Copyright © 2006 2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): OPA211 OPA2211