Datasheet

Die
DieAttach(Epoxy)
Leadframe
(CopperAlloy)
ExposedatBaseofPackage
MoldCompound
(Plastic)
Terminal
(b)CutawayView:DRGPackage(DFN-8)
MoldCompound(Plastic)
LeadframeDiePad
ExposedatBaseofthePackage
(CopperAlloy)
Leadframe(CopperAlloy)
IC(Silicon)
DieAttach(Epoxy)
(a)CutawayView:DDAPackage(SO-8)
(c)BottomView
DRGPackage
(DFN-8)
Thermal
Pad
DDAPackage
(SO-8)
Thermal
Pad
OPA211
OPA2211
www.ti.com ...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009
Figure 50. Views of Thermally-Enhanced SO-8 and DFN-8 Packages
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Product Folder Link(s): OPA211 OPA2211