Datasheet
OPA170
OPA2170
OPA4170
SBOS557B –AUGUST 2011–REVISED SEPTEMBER 2012
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Boldface limits apply over the specified temperature range, T
A
= –40°C to +125°C.
At T
A
= +25°C, V
CM
= V
OUT
= V
S
/2, and R
L
= 10kΩ connected to V
S
/2, unless otherwise noted.
OPA170, OPA2170, OPA4170
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE
Specified range –40 +125 °C
Operating range –55 +150 °C
THERMAL INFORMATION: OPA170
OPA170
THERMAL METRIC
(1)
D (SO) DBV (SOT23) DRL (SOT553) UNITS
8 PINS 5 PINS 5 PINS
θ
JA
Junction-to-ambient thermal resistance 149.5 245.8 208.1
θ
JC(top)
Junction-to-case(top) thermal resistance 97.9 133.9 0.1
θ
JB
Junction-to-board thermal resistance 87.7 83.6 42.4
°C/W
ψ
JT
Junction-to-top characterization parameter 35.5 18.2 0.5
ψ
JB
Junction-to-board characterization parameter 89.5 83.1 42.2
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2170
OPA2170
THERMAL METRIC
(1)
D (SO) DCU (VSSOP) DGK (MSOP) UNITS
8 PINS 8 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 134.3 175.2 180
θ
JC(top)
Junction-to-case(top) thermal resistance 72.1 74.9 55
θ
JB
Junction-to-board thermal resistance 60.6 22.2 130
°C/W
ψ
JT
Junction-to-top characterization parameter 18.2 1.6 5.3
ψ
JB
Junction-to-board characterization parameter 53.8 22.8 120
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4170
OPA4170
THERMAL METRIC
(1)
D (SO) PW (TSSOP) UNITS
14 PINS 14 PINS
θ
JA
Junction-to-ambient thermal resistance 93.2 106.9
θ
JC(top)
Junction-to-case(top) thermal resistance 51.8 24.4
θ
JB
Junction-to-board thermal resistance 49.4 59.3
°C/W
ψ
JT
Junction-to-top characterization parameter 13.5 0.6
ψ
JB
Junction-to-board characterization parameter 42.2 54.3
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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