Datasheet
OPA209
OPA2209
OPA4209
SBOS426C –NOVEMBER 2008–REVISED OCTOBER 2013
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ELECTRICAL CHARACTERISTICS: V
S
= ±2.25V to ±18V (continued)
Boldface limits apply over the specified temperature range, T
A
= –40°C to +125°C.
At T
A
= +25°C, R
L
= 10kΩ connected to midsupply, and V
CM
= V
OUT
= midsupply, unless otherwise noted.
OPA209, OPA2209, OPA4209
PARAMETER CONDITIONS MIN TYP MAX UNIT
OUTPUT
Voltage Output Swing R
L
= 10kΩ, A
OL
> 130dB (V–) + 0.2V (V+) – 0.2V V
R
L
= 600Ω, A
OL
> 114dB (V–) + 0.6V (V+) – 0.6V V
over Temperature R
L
= 10kΩ, A
OL
> 120dB (V–) + 0.2V (V+) – 0.2V V
Short-Circuit Current I
SC
V
S
= ±18V ±65 mA
Capacitive Load Drive (stable operation) C
LOAD
See Typical Characteristics
Open-Loop Output Impedance Z
O
See Typical Characteristics
POWER SUPPLY
Specified Voltage V
S
±2.25 ±18 V
Quiescent Current (per amplifier) I
Q
I
O
= 0A 2.2 2.5 mA
over Temperature 3.25 mA
TEMPERATURE RANGE
Specified Range T
A
–40 +125 °C
Operating Range T
A
–55 +150 °C
THERMAL INFORMATION
OPA209AID OPA209AIDBV OPA209AIDGK
THERMAL METRIC
(1)
D DBV DGK UNITS
8 5 8
θ
JA
Junction-to-ambient thermal resistance
(2)
135.5 204.9 142.6
θ
JCtop
Junction-to-case (top) thermal resistance 73.7 200 46.9
θ
JB
Junction-to-board thermal resistance 61.9 113.1 63.5
°C/W
ψ
JT
Junction-to-top characterization parameter 19.7 38.2 5.3
ψ
JB
Junction-to-board characterization parameter 54.8 104.9 62.8
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
THERMAL INFORMATION
OPA2209AID OPA2209AIDGK OPA4209AIPW
THERMAL METRIC
(1)
D DGK PW UNITS
8 8 14
θ
JA
Junction-to-ambient thermal resistance
(2)
134.3 132.7 112.9
θ
JCtop
Junction-to-case (top) thermal resistance 72.1 38.5 26.1
θ
JB
Junction-to-board thermal resistance 60.7 52.1 61.0
°C/W
ψ
JT
Junction-to-top characterization parameter 18.2 2.4 0.7
ψ
JB
Junction-to-board characterization parameter 53.8 52.8 59.2
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
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