Datasheet

OPA209
OPA2209
OPA4209
SBOS426C NOVEMBER 2008REVISED OCTOBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
SOT23-5 DBV OOBQ
OPA209 MSOP-8 DGK OOAQ
SO-8 D OPA209A
MSOP-8 DGK OOJI
OPA2209
SO-8 D O2209
OPA4209 TSSOP-14 PW OPA4209
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
OPA209, OPA2209, OPA4209 UNIT
Supply Voltage V
S
= (V+) (V–) 40 V
Signal Input Terminal, Voltage
(2)
(V–) 0.5 to (V+) + 0.5 V
Signal Input Terminal, Current (except power-supply pins)
(2)
10 mA
Output Short-Circuit
(3)
Continuous
Operating Temperature T
A
–55 to +150 °C
Storage Temperature T
A
–65 to +150 °C
Junction Temperature T
J
+200 °C
Human Body Model (HBM) 3000 V
ESD Ratings:
Charged Device Model (CDM) 1000 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) For input voltages beyond the power-supply rails, voltage or current must be limited.
(3) Short-circuit to ground, one amplifier per package.
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Product Folder Links: OPA209 OPA2209 OPA4209