Datasheet

3
®
OPA177
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
PIN CONFIGURATION
Top View DIP/SOIC
ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
DISCHARGE SENSITIVITY
Any integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. ESD can cause damage ranging
from subtle performance degradation to complete device
failure. Precision integrated circuits may be more suscep-
tible to damage because very small parametric changes
could cause the device not to meet published specifications.
Burr-Brown’s standard ESD test method consists of five
1000V positive and negative discharges (100pF in series
with 1.5kΩ) applied to each pin.
Failure to observe proper handling procedures could result
in small changes to the OPA177’s input bias current.
1
2
3
4
8
7
6
5
Offset Trim
–In
+In
V–
Offset Trim
V+
V
No Internal Connection
O
Power Supply Voltage ....................................................................... ±22V
Differential Input Voltage ................................................................... ±30V
Input Voltage ....................................................................................... ±V
S
Output Short Circuit ................................................................. Continuous
Operating Temperature:
Plastic DIP (P), SO-8 (S) .............................................. –40°C to +85°C
θ
JA
(PDIP) ................................................................................. 100°C/W
θ
JA
(SOIC)................................................................................. 160°C/W
Storage Temperature:
Plastic DIP (P), SO-8 (S) ............................................ –65°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) P packages ........................... +300°C
(soldering, 3s) S package............................... +260°C
PACKAGE
DRAWING TEMPERATURE
PRODUCT PACKAGE NUMBER
(1)
RANGE
OPA177FP 8-Pin Plastic DIP 006 –40°C to +85°C
OPA177GP 8-Pin Plastic DIP 006 –40°C to +85°C
OPA177GS SO-8 Surface-Mount 182 –40°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
PACKAGE/ORDERING INFORMATION