Datasheet
OPA171
OPA2171
OPA4171
SBOS516D –SEPTEMBER 2010–REVISED SEPTEMBER 2012
www.ti.com
THERMAL INFORMATION: OPA171
OPA171
THERMAL METRIC
(1)
D (SO) DBV (SOT23) DRL (SOT553) UNITS
8 PINS 5 PINS 5 PINS
θ
JA
Junction-to-ambient thermal resistance 149.5 245.8 208.1
θ
JC(top)
Junction-to-case(top) thermal resistance 97.9 133.9 0.1
θ
JB
Junction-to-board thermal resistance 87.7 83.6 42.4
°C/W
ψ
JT
Junction-to-top characterization parameter 35.5 18.2 0.5
ψ
JB
Junction-to-board characterization parameter 89.5 83.1 42.2
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2171
OPA2171
THERMAL METRIC
(1)
D (SO) DCU (VSSOP) DGK (MSOP) UNITS
8 PINS 8 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 134.3 175.2 195.3
θ
JC(top)
Junction-to-case(top) thermal resistance 72.1 74.9 59.4
θ
JB
Junction-to-board thermal resistance 60.6 22.2 115.1
°C/W
ψ
JT
Junction-to-top characterization parameter 18.2 1.6 4.7
ψ
JB
Junction-to-board characterization parameter 53.8 22.8 114.4
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4171
OPA4171
THERMAL METRIC
(1)
D (SO) PW (TSSOP) UNITS
14 PINS 14 PINS
θ
JA
Junction-to-ambient thermal resistance 93.2 106.9
θ
JC(top)
Junction-to-case(top) thermal resistance 51.8 24.4
θ
JB
Junction-to-board thermal resistance 49.4 59.3
°C/W
ψ
JT
Junction-to-top characterization parameter 13.5 0.6
ψ
JB
Junction-to-board characterization parameter 42.2 54.3
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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