Datasheet

OPA1652
OPA1654
SBOS477 –DECEMBER 2011 www.ti.com
ELECTRICAL CHARACTERISTICS: V
S
= ±15 V (continued)
At T
A
= +25°C, R
L
= 2 kΩ, and V
CM
= V
OUT
= midsupply, unless otherwise noted.
OPA1652, OPA1654
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE
Specified range –40 +85 °C
Operating range –55 +125 °C
THERMAL INFORMATION: OPA1652
OPA1652
THERMAL METRIC
(1)
D (SO) DGK (MSOP) UNITS
8 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 143.6 218.9
θ
JCtop
Junction-to-case (top) thermal resistance 76.9 78.6
θ
JB
Junction-to-board thermal resistance 61.8 103.7
°C/W
ψ
JT
Junction-to-top characterization parameter 27.8 14.6
ψ
JB
Junction-to-board characterization parameter 61.3 101.8
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA1654
OPA1654
THERMAL METRIC
(1)
D (SO) PW (TSSOP) UNITS
14 PINS 14 PINS
θ
JA
Junction-to-ambient thermal resistance 90.1 126.9
θ
JCtop
Junction-to-case (top) thermal resistance 54.8 46.6
θ
JB
Junction-to-board thermal resistance 44.4 58.6
°C/W
ψ
JT
Junction-to-top characterization parameter 19.9 5.5
ψ
JB
Junction-to-board characterization parameter 44.2 57.8
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): OPA1652 OPA1654