Datasheet

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OPA1632
SBOS286B –DECEMBER 2003–REVISED JANUARY 2010 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
SPECIFIED
PACKAGE TEMPERATURE PACKAGE TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING ORDERING NUMBER MEDIA, QUANTITY
OPA1632D Rails, 100
SO-8 D −40°C to +85°C OPA1632
OPA1632DR Tape and Reel, 2500
OPA1632
OPA1632DGN Rails, 100
MSOP-8
DGK −40°C to +85°C 1632
PowerPAD
OPA1632DGNR Tape and Reel, 2500
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
Over operating free-air temperature range (unless otherwise noted).
OPA1632 UNIT
Supply Voltage, ±V
S
±16.5 V
Input Voltage, V
I
±V
S
V
Output Current, I
O
150 mA
Differential Input Voltage, V
ID
±3 V
Maximum Junction Temperature, T
J
+150 °C
Operating Free-Air Temperature Range –40 to +85 °C
Storage Temperature Range, T
STG
–65 to +150 °C
Human Body Model (HBM) 1 kV
ESD Ratings Charged Device Model (CDM) 500 V
Machine Model (MM) 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) The OPA1632 MSOP-8 package version incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be
connected to a thermally-dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the
PowerPAD thermally-enhanced package.
PIN CONFIGURATION
OPA1632
MSOP-8, SO-8
(TOP VIEW)
2 Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): OPA1632