Datasheet

OPA1602
OPA1604
SBOS474B –APRIL 2011–REVISED NOVEMBER 2011 www.ti.com
ELECTRICAL CHARACTERISTICS: V
S
= ±2.25V to ±18V (continued)
At T
A
= +25°C and R
L
= 2kΩ, unless otherwise noted. V
CM
= V
OUT
= midsupply, unless otherwise noted.
OPA1602, OPA1604
PARAMETER CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
Specified Voltage V
S
±2.25 ±18 V
Quiescent Current
(3)
I
Q
I
OUT
= 0A 2.6 3.2 mA
xx Dual, per channel
Quad, per channel I
Q
I
OUT
= 0A 2.8 3.4 mA
TEMPERATURE RANGE
Specified Range –40 +85 °C
Operating Range –55 +125 °C
(3) I
Q
value is based on flash test.
THERMAL INFORMATION: OPA1602
OPA1602 OPA1602
THERMAL METRIC
(1)
D DGK UNITS
8 PINS 8 PINS
θ
JA
Junction-to-ambient thermal resistance 105.4 154.7
θ
JCtop
Junction-to-case (top) thermal resistance 58.6 49.7
θ
JB
Junction-to-board thermal resistance 64.2 107.9
°C/W
ψ
JT
Junction-to-top characterization parameter 14.1 2.5
ψ
JB
Junction-to-board characterization parameter 66.5 106.7
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA1604
OPA1604 OPA1604
THERMAL METRIC
(1)
D PW UNITS
14 PINS 14 PINS
θ
JA
Junction-to-ambient thermal resistance 92.8 122.5
θ
JCtop
Junction-to-case (top) thermal resistance 44.4 36.5
θ
JB
Junction-to-board thermal resistance 39.6 53.9
°C/W
ψ
JT
Junction-to-top characterization parameter 10.4 2.5
ψ
JB
Junction-to-board characterization parameter 39.3 53.2
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): OPA1602 OPA1604