Datasheet
OPA140
OPA2140, OPA4140
SBOS498A –JULY 2010–REVISED AUGUST 2010
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ELECTRICAL CHARACTERISTICS: V
S
= +4.5V to +36V; ±2.25V to ±18V (continued)
Boldface limits apply over the specified temperature range, T
A
= –40°C to +125°C.
At T
A
= +25°C, R
L
= 2kΩ connected to midsupply, V
CM
= V
OUT
= midsupply, unless otherwise noted.
OPA140, OPA2140, OPA4140
PARAMETER CONDITIONS MIN TYP MAX UNIT
OUTPUT
Voltage Output V
O
R
L
= 10kΩ, A
OL
≥ 108dB (V–)+0.2 (V+)–0.2 V
R
L
= 2kΩ, A
OL
≥ 108dB (V–)+0.35 (V+)–0.35 V
Short-Circuit Current I
SC
Source +36 mA
Sink –30 mA
Capacitive Load Drive C
LOAD
See Figure 20 and Figure 21
Open-Loop Output Impedance R
O
f = 1MHz, I
O
= 0 (See Figure 19) 16 Ω
POWER SUPPLY
Specified Voltage Range V
S
±2.25 ±18 V
Quiescent Current
I
Q
I
O
= 0mA 1.8 2.0 mA
(per amplifier)
Over Temperature 2.7 mA
CHANNEL SEPARATION
Channel Separation At dc 0.02 mV/V
At 100kHz 10 mV/V
TEMPERATURE RANGE
Specified Range –40 +125 °C
Operating Range –55 +150 °C
THERMAL INFORMATION
OPA140, OPA140,
OPA140
OPA2140 OPA2140
THERMAL METRIC
(1)
UNITS
D (SO) DGK (MSOP) DBV (SOT23)
8 8 5
q
JA
Junction-to-ambient thermal resistance 160 180 210
q
JC(top)
Junction-to-case(top) thermal resistance 75 55 200
q
JB
Junction-to-board thermal resistance 60 130 110
°C/W
y
JT
Junction-to-top characterization parameter 9 n/a 40
y
JB
Junction-to-board characterization parameter 50 120 105
q
JC(bottom)
Junction-to-case(bottom) thermal resistance n/a n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION
OPA4140 OPA4140
THERMAL METRIC
(1)
D (SO) PW (TSSOP) UNITS
14 14
q
JA
Junction-to-ambient thermal resistance 97 135
q
JC(top)
Junction-to-case(top) thermal resistance 56 45
q
JB
Junction-to-board thermal resistance 53 66
°C/W
y
JT
Junction-to-top characterization parameter 19 n/a
y
JB
Junction-to-board characterization parameter 46 60
q
JC(bottom)
Junction-to-case(bottom) thermal resistance n/a n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): OPA140 OPA2140 OPA4140