Datasheet

®
4
OPA128
DICE INFORMATION
PAD FUNCTION
1 Offset Trim
2 –In
3 +In
4–V
CC
5 Offset Trim
6 Output
7+V
CC
8 Substrate
NC No Connection
Substrate Bias: Isolated, normally con-
nected to common.
MECHANICAL INFORMATION
MILS (0.001") MILLIMETERS
Die Size 96 x 71 ±5 2.44 x 1.80 ±0.13
Die Thickness 20 ±3 0.51 ±0.08
Min. Pad Size 4 x 4 0.10 x 0.10
Backing None
TYPICAL PERFORMANCE CURVES
At T
A
= +25°C, ±15VDC, unless otherwise noted.
OPA128 DIE TOPOGRAPHY
COMMON-MODE REJECTION
vs INPUT COMMON-MODE VOLTAGE
–15
Common-Mode Voltage (V)
–10 –5 0 5 10 15
Common-Mode Rejection (dB)
120
110
100
90
80
70
11k10 100 10k 100k 1M 10M
Frequency (Hz)
0
20
40
60
80
100
120
140
Common-Mode Rejection (dB)
COMMON-MODE REJECTION
vs FREQUENCY
11k10 100 10k 100k 1M 10M
Frequency (Hz)
0
20
40
60
80
100
120
140
Voltage Gain (dB)
OPEN-LOOP FREQUENCY RESPONSE
–180
–135
–90
–45
Phase Shift (Degrees)
Phase
Margin
90°
Ø
Gain
∼
∼
11k10 100 10k 100k 1M 10M
Frequency (Hz)
0
20
40
60
80
100
120
140
Power Supply Rejection (dB)
POWER SUPPLY REJECTION vs FREQUENCY
–PSRR
+PSRR