Datasheet

OP07C, OP07D, OP07Y
PRECISION OPERATIONAL AMPLIFIERS
SLOS099B – OCTOBER 1983 – REVISED AUGUST 1996
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
OP07Y chip information
These chips, properly assembled, display characteristics similar to the OP07. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
OUT
V
CC–
V
CC+
OFFSET N2
IN –
IN
+
OFFSET N1
(4)
(6)
(7)
(8)
(2)
(3)
(1)
+
–
BONDING PAD ASSIGNMENTS
94
72
(4)
(6)
(7)
(8)
(2)
(3)(1)