Datasheet
MSP430L092
MSP430C09x
www.ti.com
SLAS673 –SEPTEMBER 2010
Absolute Maximum Ratings
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
Voltage applied at V
CC
referenced to V
SS
(V
AMR
) –0.3 V to 1.90 V
–0.3 V to V
CC
+ 0.3 V
Voltage applied to any pin (references to V
SS
)
–0.3 V to 1.90 V
Diode current at any device pin
(2)
±2.5 mA
Current derating factor when I/O ports are switched in parallel electrically and logically
(3)
0.9
Storage temperature range
(4)
–55°C to 150°C
ESD tolerance, Human-Body Model (HBM) 2000 V
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to V
SS
.
(3) The diode current increases to ±4.5 mA when two pins are connected, ± 6.75 mA for three pins.
(4) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Supply voltage during program execution 0.9 1.65 V
V
SS
Supply voltage (GND reference) 0 V
T
A
Operating free-air temperature 0 50 °C
C
VCC
Capacitor on V
CC
470 nF
V
CC
> 0.9 V, t
LOW
≥ 450 ns, t
HIGH
≥ 450 ns 1 MHz
f
SYSTEM
(1)(
System operating frequency
2)
V
CC
> 1.5 V, t
LOW
≥ 113 ns, t
HIGH
≥ 113 ns 4 MHz
(1) The MSP430 CPU is clocked directly with MCLK. Both the high and low phase of MCLK must not exceed the pulse width of the
specified maximum frequency.
(2) Modules may have a different maximum input clock specification. Refer to the specification of the respective module in this data sheet.
Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 21