Datasheet

MSP430G2x32
MSP430G2x02
SLAS723H –DECEMBER 2010–REVISED MAY 2013 www.ti.com
RAM
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN MAX UNIT
V
(RAMh)
RAM retention supply voltage
(1)
CPU halted 1.6 V
(1) This parameter defines the minimum supply voltage V
CC
when the data in RAM remains unchanged. No program execution should
happen during this supply voltage condition.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP MAX UNIT
f
SBW
Spy-Bi-Wire input frequency 2.2 V 0 20 MHz
t
SBW,Low
Spy-Bi-Wire low clock pulse length 2.2 V 0.025 15 µs
Spy-Bi-Wire enable time
t
SBW,En
2.2 V 1 µs
(TEST high to acceptance of first clock edge
(1)
)
t
SBW,Ret
Spy-Bi-Wire return to normal operation time 2.2 V 15 100 µs
f
TCK
TCK input frequency
(2)
2.2 V 0 5 MHz
R
Internal
Internal pulldown resistance on TEST 2.2 V 25 60 90 kΩ
(1) Tools accessing the Spy-Bi-Wire interface need to wait for the maximum t
SBW,En
time after pulling the TEST/SBWCLK pin high before
applying the first SBWCLK clock edge.
(2) f
TCK
may be restricted to meet the timing requirements of the module selected.
JTAG Fuse
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN MAX UNIT
V
CC(FB)
Supply voltage during fuse-blow condition T
A
= 25°C 2.5 V
V
FB
Voltage level on TEST for fuse blow 6 7 V
I
FB
Supply current into TEST during fuse blow 100 mA
t
FB
Time to blow fuse 1 ms
(1) Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to
bypass mode.
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