Datasheet

MSP430FW42x
SLAS383D –OCTOBER 2003–REVISED JANUARY 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. ORDERING INFORMATION
(1)
PACKAGED DEVICES
(2)
T
A
PLASTIC 64-PIN QFP
(PM)
MSP430FW423IPM
MSP430FW425IPM
−40°C to 85°C MSP430FW427IPM
MSP430FW428IPM
MSP430FW429IPM
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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