Datasheet

YQD PACKAGE
(TOP VIEW)
A2
A3
A4
A5
B1B2
B3
B4
B5
C1C2
D1D2D4
D5
E1E2E4
E5
C4
C5
D3
E3
C3
P1.1
P1.2
P1.3
P1.5
PJ.5AVCC
P1.0
P1.4
PJ.1
PJ.4
AVSS
DVCCDVSS
TEST
RST/NMI
VCOREP1.6P2.2
P2.0
PJ.2
PJ.3
P2.1
P1.7
PJ.0
D
E
A2
A3
A4
A5
B1 B2
B3
B4
B5
C1
C2
D1 D2
D4
D5
E1 E2
E4
E5
YQD PACKAGE
(BALL-SIDE VIEW)
C4
C5
D3
E3
C3
P1.1
P1.2
P1.3
P1.5
PJ.5 AVCC
P1.0
P1.4
PJ.1
PJ.4
AVSS
DVCC
DVSS
TEST
RST/NMI
VCORE
P1.6
P2.2
P2.0
PJ.2
PJ.3
P2.1
P1.7
PJ.0
E
D
MSP430FR573x
MSP430FR572x
SLAS639H JULY 2011REVISED SEPTEMBER 2013
www.ti.com
Pin Designation MSP430FR5738IYQD
Package Dimensions: The package dimensions for the YQD package are shown in Table 2. See the package
drawing at the end of this data sheet for more details.
Table 2. YQD Package Dimensions
PACKAGED DEVICES D E
MSP430FR5738IYQD 2.04 ± 0.03 2.24 ± 0.03
10 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated