Datasheet
Table Of Contents
- features
- description
- AVAILABLE OPTIONS
- DEVELOPMENT TOOL SUPPORT
- pin designation, MSP430xG461xIPZ
- pin designation, MSP430xG461xIZQW (top view)
- functional block diagram
- Terminal Functions
- short-form description
- CPU
- instruction set
- operating modes
- interrupt vector addresses
- special function registers (SFRs)
- memory organization
- bootstrap loader (BSL)
- flash memory
- peripherals
- DMA controller
- oscillator and system clock
- brownout, supply voltage supervisor
- brownout, supply voltage supervisor
- digital I/O
- Basic Timer1 and Real-Time Clock
- LCD_A drive with regulated charge pump
- watchdog timer (WDT+)
- universal serial communication interface (USCI)
- USART1
- hardware multiplier
- Timer_A3
- Timer_B7
- Comparator_A
- ADC12
- DAC12
- OA
- peripheral file map
- absolute maximum ratings over operating free-air temperature
- recommended operating conditions
- electrical characteristics
- supply current into AVCC + DVCC excluding external current
- supply current into AVCC + DVCC excluding external current
- Schmitt-trigger inputs -- Ports P1 to P10, RST/NMI, JTAG (TCK, TMS, TDI/TCLK, TDO/TDI)
- inputs Px.x, TAx, TBx
- leakage current -- Ports P1 to P10
- outputs -- Ports P1 to P10
- output frequency
- wake-up LPM3
- RAM
- LCD_A
- Comparator_A
- POR/brownout reset (BOR)
- SVS (supply voltage supervisor/monitor)
- DCO
- crystal oscillator, LFXT1 oscillator
- crystal oscillator, LFXT1 oscillator
- crystal oscillator, XT2 oscillator
- USCI (UART mode)
- USCI (SPI master mode)
- USCI (SPI slave mode)
- USCI (I2C mode)
- USART1
- 12-bit ADC, power supply and input range conditions
- 12-bit ADC, power supply and input range conditions
- 12-bit ADC, external reference
- 12-bit ADC, built-in reference
- 12-bit ADC, timing parameters
- 12-bit ADC, linearity parameters
- 12-bit ADC, temperature sensor and built-in VMID
- 12-bit DAC, supply specifications
- 12-bit DAC, linearity specifications
- 12-bit DAC, output specifications
- 12-bit DAC, reference input specifications
- 12-bit DAC, dynamic specifications; Vref = VCC, DAC12IR = 1
- operational amplifier OA, supply specifications
- operational amplifier OA, input/output specifications
- operational amplifier OA, dynamic specifications
- operational amplifier OA feedback network, noninverting amplifier mode (OAFCx = 4)
- operational amplifier OA feedback network, inverting amplifier mode (OAFCx = 6)
- flash memory (MSP430FG461x devices only)
- JTAG interface
- JTAG fuse
- APPLICATION INFORMATION
- input/output schematics
- Port P1, P1.0 to P1.5, input/output with Schmitt trigger
- Port P1 (P1.0 to P1.5) pin functions
- Port P1, P1.6, P1.7, input/output with Schmitt trigger
- Port P1 (P1.6 and P1.7) pin functions
- port P2, P2.0 to P2.3, P2.6 to P2.7, input/output with Schmitt trigger
- Port P2 (P2.0, P2.1, P2.2, P2.3, P2.6 and P2.7) pin functions
- port P2, P2.4 to P2.5, input/output with Schmitt trigger
- Port P2 (P2.4 and P2.5) pin functions
- port P3, P3.0 to P3.3, input/output with Schmitt trigger
- Port P3 (P3.0 to P3.3) pin functions
- port P3, P3.4 to P3.7, input/output with Schmitt trigger
- Port P3 (P3.4 to P3.7) pin functions
- port P4, P4.0 to P4.1, input/output with Schmitt trigger
- Port P4 (P4.0 to P4.1) pin functions
- port P4, P4.2 to P4.7, input/output with Schmitt trigger
- Port P4 (P4.2 to P4.5) pin functions
- port P5, P5.0, input/output with Schmitt trigger
- Port P5 (P5.0) pin functions
- port P5, P5.1, input/output with Schmitt trigger
- Port P5 (P5.1) pin functions
- port P5, P5.2 to P5.4, input/output with Schmitt trigger
- Port P5 (P5.2 to P5.4) pin functions
- port P5, P5.5 to P5.7, input/output with Schmitt trigger
- Port P5 (P5.5 to P5.7) pin functions
- port P6, P6.0, P6.2, and P6.4, input/output with Schmitt trigger
- Port P6 (P6.0, P6.2, and P6.4) pin functions
- port P6, P6.1, P6.3, and P6.5 input/output with Schmitt trigger
- Port P6 (P6.1, P6.3, and P6.5) pin functions
- port P6, P6.6, input/output with Schmitt trigger
- Port P6 (P6.6) pin functions
- port P6, P6.7, input/output with Schmitt trigger
- Port P6 (P6.7) pin functions
- port P7, P7.0 to P7.3, input/output with Schmitt trigger
- Port P7 (P7.0 to P7.1) pin functions
- port P7, P7.4 to P7.7, input/output with Schmitt trigger
- Port P7 (P7.4 to P7.5) pin functions
- port P8, P8.0 to P8.7, input/output with Schmitt trigger
- Port P8 (P8.0 to P8.1) pin functions
- Port P8 (P8.6 to P8.7) pin functions
- port P9, P9.0 to P9.7, input/output with Schmitt trigger
- Port P9 (P9.0 to P9.1) pin functions
- port P10, P10.0 to P10.5, input/output with Schmitt trigger
- Port P10 (P10.0 to P10.1) pin functions
- port P10, P10.6, input/output with Schmitt trigger
- Port P10 (P10.6) pin functions
- port P10, P10.7, input/output with Schmitt trigger
- Port P10 (P10.7) pin functions
- VeREF+/DAC0
- JTAG pins TMS, TCK, TDI/TCLK, TDO/TDI, input/output with Schmitt trigger or output
- JTAG fuse check mode
- input/output schematics
- Data Sheet Revision History
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
MSP430FG4618IZQWT ACTIVE BGA
MICROSTAR
JUNIOR
ZQW 113 250 Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR M430FG4618
MSP430FG4619IPZ ACTIVE LQFP PZ 100 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 M430FG4619
REV #
MSP430FG4619IPZR ACTIVE LQFP PZ 100 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 M430FG4619
MSP430FG4619IZQW ACTIVE BGA
MICROSTAR
JUNIOR
ZQW 113 250 Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR -40 to 85 M430FG4619
MSP430FG4619IZQWR ACTIVE BGA
MICROSTAR
JUNIOR
ZQW 113 2500 Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR -40 to 85 M430FG4619
MSP430FG4619IZQWT ACTIVE BGA
MICROSTAR
JUNIOR
ZQW 113 250 Green (RoHS
& no Sb/Br)
SNAGCU Level-3-260C-168 HR -40 to 85 M430FG4619
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.