Datasheet

Table Of Contents
MSP430xG461x
MIXED SIGNAL MICROCONTROLLER
SLAS508I − APRIL 2006 − REVISED MARCH 2011
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
AVAILABLE OPTIONS
{
PACKAGED DEVICES
}
T
A
PLASTIC 100-PIN TQFP
(PZ)
PLASTIC 113-BALL BGA
(ZQW)
MSP430FG4616IPZ MSP430FG4616IZQW
MSP430FG4617IPZ MSP430FG4617IZQW
MSP430FG4618IPZ MSP430FG4618IZQW
40°Cto85°C
MSP430FG4619IPZ MSP430FG4619IZQW
−40°C to 85°C
MSP430CG4616IPZ MSP430CG4616IZQW
MSP430CG4617IPZ MSP430CG4617IZQW
MSP430CG4618IPZ MSP430CG4618IZQW
MSP430CG4619IPZ MSP430CG4619IZQW
For the most current package and ordering information, see the Package Option
Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at
www.ti.com/packaging.
DEVELOPMENT TOOL SUPPORT
All MSP430 microcontrollers include an Embedded Emulation Module (EEM) allowing advanced debugging
and programming through easy-to-use development tools. Recommended hardware options include:
D Debugging and Programming Interface
MSP-FET430UIF (USB)
MSP-FET430PIF (Parallel Port)
D Debugging and Programming Interface with Target Board
MSP-FET430U100 (for PZ package)
D Standalone Target Board
MSP-TS430PZ100 (for PZ package)
D Production Programmer
MSP-GANG430