Datasheet

MSP430xG461x
MIXED SIGNAL MICROCONTROLLER
SLAS508I − APRIL 2006 − REVISED MARCH 2011
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AVAILABLE OPTIONS
{
PACKAGED DEVICES
}
T
A
PLASTIC 100-PIN TQFP
(PZ)
PLASTIC 113-BALL BGA
(ZQW)
MSP430FG4616IPZ MSP430FG4616IZQW
MSP430FG4617IPZ MSP430FG4617IZQW
MSP430FG4618IPZ MSP430FG4618IZQW
40°Cto85°C
MSP430FG4619IPZ MSP430FG4619IZQW
−40°C to 85°C
MSP430CG4616IPZ MSP430CG4616IZQW
MSP430CG4617IPZ MSP430CG4617IZQW
MSP430CG4618IPZ MSP430CG4618IZQW
MSP430CG4619IPZ MSP430CG4619IZQW
†
For the most current package and ordering information, see the Package Option
Addendum at the end of this document, or see the TI
web site at www.ti.com.
‡
Package drawings, thermal data, and symbolization are available at
www.ti.com/packaging.
DEVELOPMENT TOOL SUPPORT
All MSP430 microcontrollers include an Embedded Emulation Module (EEM) allowing advanced debugging
and programming through easy-to-use development tools. Recommended hardware options include:
D Debugging and Programming Interface
− MSP-FET430UIF (USB)
− MSP-FET430PIF (Parallel Port)
D Debugging and Programming Interface with Target Board
− MSP-FET430U100 (for PZ package)
D Standalone Target Board
− MSP-TS430PZ100 (for PZ package)
D Production Programmer
− MSP-GANG430