Datasheet
MSP430F5438, MSP430F5437, MSP430F5436, MSP430F5435
MSP430F5419, MSP430F5418
SLAS612D –AUGUST 2009–REVISED AUGUST 2013
www.ti.com
Electrical Characteristics
Active Mode Supply Current Into V
CC
Excluding External Current
over recommended operating free-air temperature (unless otherwise noted)
(1) (2) (3)
Frequency (f
DCO
= f
MCLK
= f
SMCLK
)
EXECUTION
PARAMETER V
CC
PMMCOREVx 1 MHz 4 MHz 8 MHz 16 MHz UNIT
MEMORY
TYP MAX TYP MAX TYP MAX TYP MAX
I
AM, Flash
Flash 3.0 V 2 0.37 0.45 1.27 1.47 2.50 2.84 5.00 5.56 mA
I
AM, RAM
RAM 3.0 V 2 0.20 0.29 0.60 0.72 1.12 1.27 2.20 2.60 mA
(1) All inputs are tied to 0 V or to V
CC
. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
(3) Characterized with program executing worst case JMP $.
f
ACLK
= 32786 Hz, f
DCO
= f
MCLK
= f
SMCLK
at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0.
Low-Power Mode Supply Currents (Into V
CC
) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(1) (2)
-40 °C 25 °C 55 °C 85°C
PARAMETER V
CC
PMMCOREVx UNIT
TYP MAX TYP MAX TYP MAX TYP MAX
Low-power mode 0
(3)
I
LPM0,1MHz
3.0 V 2 86 98 86 98 86 98 86 98 µA
(4)
Low-power mode 2
(5)
I
LPM2
3.0 V 2 8.0 15.6 8.0 15.6 8.0 15.6 8.0 15.6 µA
(4)
Low-power mode 3,
I
LPM3,XT1LF
3.0 V 2 2.3 2.6 3.37 4.5 7.9 15.6 µA
crystal mode
(6) (4)
Low-power mode 3,
I
LPM3,VLO
3.0 V 2 1.39 1.80 2.30 2.95 6.9 14.6 µA
VLO mode
(7) (4)
Low-power mode 4
(8)
I
LPM4
3.0 V 2 1.26 1.69 2.2 3.6 6.8 14.5 µA
(4)
(1) All inputs are tied to 0 V or to V
CC
. Outputs do not source or sink any current.
(2) The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
(3) Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); f
ACLK
= 32768 Hz, f
MCLK
= 0 MHz, f
SMCLK
= f
DCO
= 1 MHz
(4) Current for brownout included. High and low side supervisor and monitors disabled (SVS
H
, SVM
H
, SVS
L
, SVM
L
). RAM retention
enabled.
(5) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); f
ACLK
= 32768 Hz, f
MCLK
= 0 MHz, f
SMCLK
= f
DCO
= 0 MHz; DCO setting = 1
MHz operation, DCO bias generator enabled.
(6) Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); f
ACLK
= 32768 Hz, f
MCLK
= f
SMCLK
= f
DCO
= 0 MHz
(7) Current for watchdog timer and RTC clocked by ACLK included. For this condition, the VLO must be selected as the source for ACLK,
MCLK, and SMCLK otherwise additional current will be drawn due to the REFO oscillator. ACLK = MCLK = SMCLK = VLO.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); f
ACLK
= f
VLO
, f
MCLK
= f
SMCLK
= f
VLO
= 0 MHz
(8) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); f
DCO
= f
ACLK
= f
MCLK
= f
SMCLK
= 0 MHz
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