Datasheet
Table Of Contents
- Features
- Applications
- Description
- Development Tools Support
- Device and Development Tool Nomenclature
- Short-Form Description
- CPU
- Operating Modes
- Interrupt Vector Addresses
- Memory Organization
- Bootstrap Loader (BSL)
- JTAG Operation
- Flash Memory
- RAM Memory
- Peripherals
- Digital I/O
- Port Mapping Controller
- Oscillator and System Clock
- Power Management Module (PMM)
- Hardware Multiplier
- Real-Time Clock (RTC_A)
- Watchdog Timer (WDT_A)
- System Module (SYS)
- DMA Controller
- Universal Serial Communication Interface (USCI)
- TA0
- TA1
- TA2
- TB0
- Comparator_B
- ADC12_A
- CRC16
- REF Voltage Reference
- Embedded Emulation Module (EEM)
- Peripheral File Map
- Absolute Maximum Ratings
- Thermal Packaging Characteristics
- Recommended Operating Conditions
- Electrical Characteristics
- Active Mode Supply Current Into VCC Excluding External Current
- Low-Power Mode Supply Currents (Into VCC) Excluding External Current
- Schmitt-Trigger Inputs – General Purpose I/O (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3, RST/NMI)
- Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
- Leakage Current – General Purpose I/O (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3, RST/NMI)
- Outputs – General Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3)
- Outputs – General Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3)
- Output Frequency – General Purpose I/O (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3)
- Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
- Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
- Crystal Oscillator, XT1, Low-Frequency Mode
- Crystal Oscillator, XT2
- Internal Very-Low-Power Low-Frequency Oscillator (VLO)
- Internal Reference, Low-Frequency Oscillator (REFO)
- DCO Frequency
- PMM, Brown-Out Reset (BOR)
- PMM, Core Voltage
- PMM, SVS High Side
- PMM, SVM High Side
- PMM, SVS Low Side
- PMM, SVM Low Side
- Wake Up From Low Power Modes and Reset
- Timer_A
- Timer_B
- USCI (UART Mode) Recommended Operating Conditions
- USCI (UART Mode)
- USCI (SPI Master Mode) Recommended Operating Conditions
- USCI (SPI Master Mode)
- USCI (SPI Slave Mode)
- USCI (I2C Mode)
- 12-Bit ADC, Power Supply and Input Range Conditions
- 12-Bit ADC, Timing Parameters
- 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
- 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
- 12-Bit ADC, Temperature Sensor and Built-In VMID
- REF, External Reference
- REF, Built-In Reference
- Comparator B
- Flash Memory
- JTAG and Spy-Bi-Wire Interface
- Input/Output Schematics
- Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
- Port P2, P2.7, Input/Output With Schmitt Trigger
- Port P3, P3.0 to P3.4, Input/Output With Schmitt Trigger
- Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
- Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
- Port P5, P5.2, Input/Output With Schmitt Trigger
- Port P5, P5.3, Input/Output With Schmitt Trigger
- Port P5, P5.4 and P5.5 Input/Output With Schmitt Trigger
- Port P5, P5.7, Input/Output With Schmitt Trigger
- Port P6, P6.1 to P6.5, Input/Output With Schmitt Trigger
- Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
- Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
- Device Descriptors
- Revision History
MSP430F5342, MSP430F5341, MSP430F5340
www.ti.com
SLAS706E –JULY 2011–REVISED AUGUST 2013
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
PARAMETER MIN TYP MAX UNIT
CONDITIONS
DV
CC(PGM/ERASE)
Program or erase supply voltage 1.8 3.6 V
I
PGM
Average supply current from DVCC during program 3 5 mA
I
ERASE
Average supply current from DVCC during erase 6 11 mA
Average supply current from DVCC during mass erase or bank
I
MERASE
, I
BANK
6 11 mA
erase
t
CPT
Cumulative program time See
(1)
16 ms
Program and erase endurance 10
4
10
5
cycles
t
Retention
Data retention duration T
J
= 25°C 100 years
t
Word
Word or byte program time See
(2)
64 85 µs
t
Block, 0
Block program time for first byte or word See
(2)
49 65 µs
Block program time for each additional byte or word, except for last
t
Block, 1–(N–1)
See
(2)
37 49 µs
byte or word
t
Block, N
Block program time for last byte or word See
(2)
55 73 µs
Erase time for segment, mass erase, and bank erase (when
t
Erase
See
(2)
23 32 ms
available)
MCLK frequency in marginal read mode
f
MCLK,MGR
0 1 MHz
(FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1)
(1) The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
(2) These values are hardwired into the flash controller's state machine.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER V
CC
MIN TYP MAX UNIT
f
SBW
Spy-Bi-Wire input frequency 2.2 V, 3 V 0 20 MHz
t
SBW,Low
Spy-Bi-Wire low clock pulse length 2.2 V, 3 V 0.025 15 µs
t
SBW, En
Spy-Bi-Wire enable time, TEST high to acceptance of first clock edge
(1)
2.2 V, 3 V 1 µs
t
SBW,Rst
Spy-Bi-Wire return to normal operation time 15 100 µs
2.2 V 0 5 MHz
f
TCK
TCK input frequency, 4-wire JTAG
(2)
3 V 0 10 MHz
R
internal
Internal pulldown resistance on TEST 2.2 V, 3 V 45 60 80 kΩ
(1) Tools accessing the Spy-Bi-Wire interface must wait for the t
SBW,En
time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
(2) f
TCK
may be restricted to meet the timing requirements of the module selected.
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