Datasheet
Table Of Contents
- Features
- Applications
- Description
- Development Tools Support
- Device and Development Tool Nomenclature
- Short-Form Description
- CPU
- Operating Modes
- Interrupt Vector Addresses
- Memory Organization
- Bootstrap Loader (BSL)
- JTAG Operation
- Flash Memory
- RAM Memory
- Peripherals
- Digital I/O
- Port Mapping Controller
- Oscillator and System Clock
- Power Management Module (PMM)
- Hardware Multiplier
- Real-Time Clock (RTC_A)
- Watchdog Timer (WDT_A)
- System Module (SYS)
- DMA Controller
- Universal Serial Communication Interface (USCI)
- TA0
- TA1
- TA2
- TB0
- Comparator_B
- ADC12_A
- CRC16
- REF Voltage Reference
- Embedded Emulation Module (EEM)
- Peripheral File Map
- Absolute Maximum Ratings
- Thermal Packaging Characteristics
- Recommended Operating Conditions
- Electrical Characteristics
- Active Mode Supply Current Into VCC Excluding External Current
- Low-Power Mode Supply Currents (Into VCC) Excluding External Current
- Schmitt-Trigger Inputs – General Purpose I/O (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3, RST/NMI)
- Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
- Leakage Current – General Purpose I/O (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3, RST/NMI)
- Outputs – General Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3)
- Outputs – General Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3)
- Output Frequency – General Purpose I/O (P1.0 to P1.7, P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P5.7, P6.1 to P6.5, PJ.0 to PJ.3)
- Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
- Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
- Crystal Oscillator, XT1, Low-Frequency Mode
- Crystal Oscillator, XT2
- Internal Very-Low-Power Low-Frequency Oscillator (VLO)
- Internal Reference, Low-Frequency Oscillator (REFO)
- DCO Frequency
- PMM, Brown-Out Reset (BOR)
- PMM, Core Voltage
- PMM, SVS High Side
- PMM, SVM High Side
- PMM, SVS Low Side
- PMM, SVM Low Side
- Wake Up From Low Power Modes and Reset
- Timer_A
- Timer_B
- USCI (UART Mode) Recommended Operating Conditions
- USCI (UART Mode)
- USCI (SPI Master Mode) Recommended Operating Conditions
- USCI (SPI Master Mode)
- USCI (SPI Slave Mode)
- USCI (I2C Mode)
- 12-Bit ADC, Power Supply and Input Range Conditions
- 12-Bit ADC, Timing Parameters
- 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
- 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
- 12-Bit ADC, Temperature Sensor and Built-In VMID
- REF, External Reference
- REF, Built-In Reference
- Comparator B
- Flash Memory
- JTAG and Spy-Bi-Wire Interface
- Input/Output Schematics
- Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
- Port P2, P2.7, Input/Output With Schmitt Trigger
- Port P3, P3.0 to P3.4, Input/Output With Schmitt Trigger
- Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
- Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
- Port P5, P5.2, Input/Output With Schmitt Trigger
- Port P5, P5.3, Input/Output With Schmitt Trigger
- Port P5, P5.4 and P5.5 Input/Output With Schmitt Trigger
- Port P5, P5.7, Input/Output With Schmitt Trigger
- Port P6, P6.1 to P6.5, Input/Output With Schmitt Trigger
- Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
- Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
- Device Descriptors
- Revision History
MSP430F5342, MSP430F5341, MSP430F5340
SLAS706E –JULY 2011–REVISED AUGUST 2013
www.ti.com
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at V
CC
to V
SS
-0.3 V to 4.1 V
Voltage applied to any pin (excluding VCORE)
(2)
-0.3 V to V
CC
+ 0.3 V
Diode current at any device pin ±2 mA
Storage temperature range, T
stg
(3)
-55°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings " may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to V
SS
. VCORE is for internal device usage only. No external DC loading or voltage should be applied.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics
θ
JA
Junction-to-ambient thermal resistance, still air High-K board (JESD51-7) VQFN (RGZ) 27.8 °C/W
θ
JC
Junction-to-case thermal resistance VQFN (RGZ) 13.6 °C/W
θ
JB
Junction-to-board thermal resistance VQFN (RGZ) 4.7 °C/W
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