Datasheet

MSP430F532x

SLAS678D –AUGUST 2010–REVISED FEBRUARY 2013

www.ti.com

Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

Voltage applied at V

to V

–0.3 V to 4.1 V

Voltage applied to any pin (excluding VCORE, LDOI)

(2)

–0.3 V to V

+ 0.3 V

Diode current at any device pin ±2 mA

Storage temperature range, T

stg

(3)

–55°C to 150°C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages referenced to V

. VCORE is for internal device usage only. No external DC loading or voltage should be applied.

(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow

temperatures not higher than classified on the device label on the shipping boxes or reels.

Thermal Packaging Characteristics

LQFP (PN) 70

Low-K board (JESD51-3) VQFN (RGC) 55

BGA (ZQE) 84

Junction-to-ambient thermal resistance, still air °C/W

LQFP (PN) 45

High-K board (JESD51-7) VQFN (RGC) 25

BGA (ZQE) 46

LQFP (PN) 12

Junction-to-case thermal resistance VQFN (RGC) 12 °C/W

BGA (ZQE) 30

LQFP (PN) 22

Junction-to-board thermal resistance VQFN (RGC) 6 °C/W

BGA (ZQE) 20