Datasheet

MSP430F5172, MSP430F5152, MSP430F5132
MSP430F5171, MSP430F5151, MSP430F5131
SLAS619J –AUGUST 2010–REVISED OCTOBER 2013 www.ti.com
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
Voltage V
CC
applied at DVCC to DVSS –0.3 V to 4.1 V
Voltage V
IO
applied at VIO to DVSS –0.3 V to 6.1 V
Voltage applied to any pin (excluding VCORE)
(2)
–0.3 V to V
CC
+ 0.3 V
Diode current at any device pin ±2 mA
Storage temperature range, T
stg
–55°C to 150°C
Maximum operating junction temperature, T
J
95°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to V
SS
. V
CORE
is for internal device usage only. No external dc loading or voltage should be applied.
Thermal Packaging Characteristics
QFN (RSB) 87°C/W
Low-K board (JESD51-3)
TSSOP (DA) 109°C/W
θ
JA
Junction-to-ambient thermal resistance, still air
QFN (RSB) 35°C/W
High-K board (JESD51-7)
TSSOP (DA) 69°C/W
QFN (RSB) 36°C/W
θ
JC
Junction-to-case thermal resistance
TSSOP (DA) 19°C/W
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