Datasheet

MSP430F5172, MSP430F5152, MSP430F5132
MSP430F5171, MSP430F5151, MSP430F5131
SLAS619K –AUGUST 2010–REVISED JANUARY 2014 www.ti.com
Crystal Oscillator, XT1, High-Frequency Mode
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP MAX UNIT
f
OSC
= 4 MHz,
XTS = 1, XOSCOFF = 0,
200
XT1BYPASS = 0, XT1DRIVEx = 0,
T
A
= 25°C
f
OSC
= 12 MHz,
XTS = 1, XOSCOFF = 0,
260
XT1BYPASS = 0, XT1DRIVEx = 1,
Differential XT1 oscillator crystal
T
A
= 25°C
I
DVCC,HF
current consumption from lowest µA
f
OSC
= 20 MHz,
drive setting, HF mode
XTS = 1, XOSCOFF = 0,
3 V 325
XT1BYPASS = 0, XT1DRIVEx = 2,
T
A
= 25°C
f
OSC
= 32 MHz,
XTS = 1, XOSCOFF = 0,
450
XT1BYPASS = 0, XT1DRIVEx = 3,
T
A
= 25°C
XT1 oscillator crystal frequency, XTS = 1,
f
XT1,HF0
4 8 MHz
HF mode 0 XT1BYPASS = 0, XT1DRIVEx = 0
(2)
XT1 oscillator crystal frequency, XTS = 1,
f
XT1,HF1
8 16 MHz
HF mode 1 XT1BYPASS = 0, XT1DRIVEx = 1
(2)
XT1 oscillator crystal frequency, XTS = 1,
f
XT1,HF2
16 24 MHz
HF mode 2 XT1BYPASS = 0, XT1DRIVEx = 2
(2)
XT1 oscillator crystal frequency, XTS = 1,
f
XT1,HF3
24 32 MHz
HF mode 3 XT1BYPASS = 0, XT1DRIVEx = 3
(2)
XT1 oscillator logic-level square- XTS = 1,
f
XT1,HF,SW
0.7 32 MHz
wave input frequency, HF mode XT1BYPASS = 1
(3) (2)
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0, 450
f
XT1,HF
= 6 MHz, C
L,eff
= 15 pF
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 1, 320
f
XT1,HF
= 12 MHz, C
L,eff
= 15 pF
Oscillation allowance for
OA
HF
Ω
HF crystals
(4)
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2, 200
f
XT1,HF
= 20 MHz, C
L,eff
= 15 pF
XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 3, 200
f
XT1,HF
= 32 MHz, C
L,eff
= 15 pF
f
OSC
= 6 MHz, XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 0, 0.5
T
A
= 25°C, C
L,eff
= 15 pF
t
START,HF
Startup time, HF mode 3 V ms
f
OSC
= 20 MHz, XTS = 1,
XT1BYPASS = 0, XT1DRIVEx = 2, 0.3
T
A
= 25°C, C
L,eff
= 15 pF
Integrated effective load
C
L,eff
XTS = 1 1 pF
capacitance, HF mode
(5) (6)
(1) To improve EMI on the XT1 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and techniques that avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(2) Maximum frequency of operation of the entire device cannot be exceeded.
(3) When XT1BYPASS is set, the VLO, REFO, XT1 circuits are automatically powered down.
(4) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(5) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(6) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
50 Submit Documentation Feedback Copyright © 2010–2014, Texas Instruments Incorporated
Product Folder Links: MSP430F5172 MSP430F5152 MSP430F5132 MSP430F5171 MSP430F5151 MSP430F5131