Datasheet
Table Of Contents
- features
- description
- DEVELOPMENT TOOL SUPPORT
- pin designation, MSP430x4351IPN, MSP430x4361IPN, MSP430x4371IPN
- pin designation, MSP430x435IPZ, MSP430x436IPZ, MSP430x4371IPZ
- pin designation, MSP430x435IPN, MSP430x436IPN, MSP430x437IPN
- pin designation, MSP430x435IPZ, MSP430x436IPZ, MSP430x437IPZ
- pin designation, MSP430x4481IPZ, MSP430x4491IPZ
- pin designation, MSP430x447IPZ, MSP430x448IPZ, MSP430x449IPZ
- MSP430x43x1 functional block diagram
- MSP430x43x functional block diagram
- MSP430x44x1 functional block diagram
- MSP430x44x functional block diagram
- MSP430x43x1 Terminal Functions
- MSP430x43x Terminal Functions
- MSP430x44x1 Terminal Functions
- MSP430x44x Terminal Functions
- short-form description
- CPU
- instruction set
- operating modes
- interrupt vector addresses
- special function registers
- interrupt enable 1 and 2
- interrupt flag register 1 and 2
- module enable registers 1 and 2
- memory organization
- bootstrap loader (BSL)
- flash memory
- peripherals
- digital I/O
- oscillator and system clock
- brownout, supply voltage supervisor (SVS)
- hardware multiplier (MSP430x44x(1) only)
- watchdog timer (WDT)
- USART0
- USART1 (MSP430x44x(1) only)
- Timer_A3
- Timer_B3 (MSP430x43x(1) only)
- Timer_B7 (MSP430x44x(1) only)
- Comparator_A
- ADC12 (not implemented in MSP430x43x1 and MSP430x44x1)
- Basic Timer1
- LCD driver
- peripheral file map
- absolute maximum ratings
- recommended operating conditions
- electrical characteristics
- supply current into AVCC + DVCC excluding external current
- Schmitt-trigger inputs - ports P1, P2, P3, P4, P5, P6
- standard inputs - RST/NMI, JTAG (TCK, TMS, TDI/TCLK)
- inputs Px.x, TAx, TBx
- leakage current
- outputs - ports P1, P2, P3, P4, P5, P6
- output frequency
- wake-up LPM3
- RAM
- LCD
- Comparator_A
- POR/brownout reset (BOR)
- supply voltage supervisor/monitor (SVS)
- DCO
- crystal oscillator, LFXT1 oscillator
- crystal oscillator, XT2 oscillator
- USART0, USART1
- 12-bit ADC, power supply and input range conditions
- 12-bit ADC, external reference
- 12-bit ADC, built-in reference
- 12-bit ADC, timing parameters
- 12-bit ADC, linearity parameters
- 12-bit ADC, temperature sensor and built-in VMID
- flash memory
- JTAG interface
- JTAG fuse
- APPLICATION INFORMATION
- input/output schematics
- port P1, P1.0 to P1.5, input/output with Schmitt trigger
- port P1, P1.6, P1.7, input/output with Schmitt trigger
- port P2, P2.0, P2.4 to P2.5, input/output with Schmitt trigger
- port P2, P2.1 to P2.3, input/output with Schmitt trigger
- port P2, P2.6 to P2.7, input/output with Schmitt trigger
- port P3, P3.0 to P3.3, input/output with Schmitt trigger
- port P3, P3.4 to P3.7, input/output with Schmitt trigger
- port P4, P4.0 to P4.7, input/output with Schmitt trigger
- port P5, P5.0 to P5.1, input/output with Schmitt trigger
- port P5, P5.2 to P5.4, input/output with Schmitt trigger
- port P5, P5.5 to P5.7, input/output with Schmitt trigger
- port P6, P6.0 to P6.6, input/output with Schmitt trigger
- port P6, P6.0 to P6.6, input/output with Schmitt trigger
- port P6, P6.7, input/output with Schmitt trigger
- JTAG pins TMS, TCK, TDI/TCLK, TDO/TDI, input/output with Schmitt trigger or output
- JTAG fuse check mode
- input/output schematics
- Data Sheet Revision History

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 3
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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