Datasheet
Table Of Contents
- features
- description
- Available Options
- pin designation
- functional block diagram
- Terminal Functions
- short-form description
- absolute maximum ratings
- recommended operating conditions
- electrical characteristics over recommended operating free-air temperature
- supply current into AVCC + DVCC excluding external
- current consumption of active mode versus system frequency
- current consumption of active mode versus supply voltage
- Schmitt-trigger inputs -- Ports P1 and P2, RST/NMI, JTAG (TCK, TMS, TDI/TCLK, TDO/TDI)
- inputs Px.x, TAx
- leakage current
- outputs -- Ports P1 and P2
- output frequency
- wake-up LPM3
- RAM
- LCD
- USART0
- POR brownout, reset
- SVS (supply voltage supervisor/monitor)
- DCO
- crystal oscillator, LFXT1 oscillator
- SD16, power supply and recommended operating conditions
- SD16, analog input range
- SD16, analog performance (fSD16 = 1MHz, SD16OSRx = 256, SD16REFON = 1)
- SD16, built-in voltage reference
- SD16, built-in reference output buffer
- SD16, external reference input
- flash memory
- JTAG interface
- JTAG fuse
- Application Information
- input/output schematic
- Port P1, P1.0 to P1.1, input/output with Schmitt trigger
- Port P1, P1.2 to P1.7, input/output with Schmitt trigger
- Port P2, P2.0 to P2.1, input/output with Schmitt trigger
- Port P2, P2.2 to P2.5, input/output with Schmitt trigger
- Port P2, unbonded GPIOs P2.6 and P2.7
- JTAG pins (TMS, TCK, TDI/TCLK, TDO/TDI), input/output with Schmitt trigger or output
- JTAG fuse check mode
- input/output schematic
- Data Sheet Revision History
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PM (S-PQFP-G64) PLASTIC QUAD FLATPACK
4040152/C 11/96
32
17
0,13 NOM
0,25
0,45
0,75
Seating Plane
0,05 MIN
Gage Plane
0,27
33
16
48
1
0,17
49
64
SQ
SQ
10,20
11,80
12,20
9,80
7,50 TYP
1,60 MAX
1,45
1,35
0,08
0,50
M
0,08
0°–7°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. May also be thermally enhanced plastic with leads connected to the die pads.