Datasheet
Table Of Contents
- features
- description
- Available Options
- pin designation
- functional block diagram
- Terminal Functions
- short-form description
- absolute maximum ratings
- recommended operating conditions
- electrical characteristics over recommended operating free-air temperature
- supply current into AVCC + DVCC excluding external
- current consumption of active mode versus system frequency
- current consumption of active mode versus supply voltage
- Schmitt-trigger inputs -- Ports P1 and P2, RST/NMI, JTAG (TCK, TMS, TDI/TCLK, TDO/TDI)
- inputs Px.x, TAx
- leakage current
- outputs -- Ports P1 and P2
- output frequency
- wake-up LPM3
- RAM
- LCD
- USART0
- POR brownout, reset
- SVS (supply voltage supervisor/monitor)
- DCO
- crystal oscillator, LFXT1 oscillator
- SD16, power supply and recommended operating conditions
- SD16, analog input range
- SD16, analog performance (fSD16 = 1MHz, SD16OSRx = 256, SD16REFON = 1)
- SD16, built-in voltage reference
- SD16, built-in reference output buffer
- SD16, external reference input
- flash memory
- JTAG interface
- JTAG fuse
- Application Information
- input/output schematic
- Port P1, P1.0 to P1.1, input/output with Schmitt trigger
- Port P1, P1.2 to P1.7, input/output with Schmitt trigger
- Port P2, P2.0 to P2.1, input/output with Schmitt trigger
- Port P2, P2.2 to P2.5, input/output with Schmitt trigger
- Port P2, unbonded GPIOs P2.6 and P2.7
- JTAG pins (TMS, TCK, TDI/TCLK, TDO/TDI), input/output with Schmitt trigger or output
- JTAG fuse check mode
- input/output schematic
- Data Sheet Revision History
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
MSP430F423AIPM ACTIVE LQFP PM 64 160 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F423A
MSP430F423AIPMR ACTIVE LQFP PM 64 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F423A
MSP430F425AIPM ACTIVE LQFP PM 64 160 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F425A
MSP430F425AIPMR ACTIVE LQFP PM 64 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F425A
MSP430F427AIPM ACTIVE LQFP PM 64 160 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F427A
MSP430F427AIPMR ACTIVE LQFP PM 64 1000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 M430F427A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.